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Maxim Integrated Voltage Level Translator 8 Bi-Directional, 20-Pin TSSOP MAX3000EEUP+
Specifications
| Country of Origin | India |
|---|---|
| Brand | Maxim Integrated |
| Height | 750μm |
| Length | 6.6mm |
| Model | MAX3000EEUP+ |
| Mount Type | Surface |
| Output type | 3 State |
| Series | MAX3000 |
| Maximum Operating Temperature | 85°C |
| Package Type | TSSOP |
| Minimum Operating Temperature | -40°C |
| Pin Count | 20 |
| Number of Elements per Chip | 8 |
| Maximum Supply Voltage | 5.5V |
| Logic Family | BiCMOS |
| Logic Function | Level Translator |
| Minimum Supply Voltage | 1.65V |
| Maximum Propagation Delay Time @ CL | 1000ns |
| Direction Type | Bi-Directional |
| Maximum Low Level Output Current | 2μA |
| Translation | Bi-Directional |
Key Features
- Utilizes BiCMOS logic family technology for efficient performance.
- Bi-directional translation without the need for a directional pin.
- Compact 20-pin TSSOP surface mount package for easy PCB integration.
- Operational supply voltage range from 1.65V to 5.5V.
- Low maximum propagation delay time of 1000ns at specified loading.
- Supports operating temperatures between -40°C and 85°C for reliability.
- Ultra-low maximum low level output current of 2μA minimizes power consumption.
- Typical applications include cell phones, GPS devices, portable communication, and smart card readers.
Product Description
Maxim Integrated presents the MAX3000EEUP+, a high-performance Voltage Level Translator featuring 8 bi-directional elements packaged in a compact 20-pin TSSOP surface mount form factor. Operating within a broad supply voltage range of 1.65V to 5.5V, this BiCMOS family logic IC ensures reliable level translation without requiring a directional pin, simplifying circuit design and reducing component count.
This device boasts a maximum propagation delay of 1000ns under a 1000pF load, enabling swift signal processing suitable for various electronic applications. Designed to operate across a temperature range from -40°C to 85°C, the MAX3000EEUP+ is robust enough for demanding industrial and commercial environments.
With ultra-low maximum low level output current of 2μA, it is optimized for low-power designs. The device also includes ±15kV ESD protection on I/O and VCC lines, safeguarding sensitive components against electrostatic discharge events.
Its compact TSSOP package allows for efficient PCB space utilization, ideal for portable and handheld devices such as cell phones, GPS receivers, portable POS systems, and smart card readers. The MAX3000EEUP+ is well-suited for telecommunications equipment and low-cost serial interface applications, offering a versatile solution for voltage level shifting requirements.
Utilizes BiCMOS logic family technology for efficient performance. Bi-directional translation without directional pin simplifies integration. Compact 20-pin TSSOP surface mount package maximizes PCB space. Wide supply voltage range from 1.65V to 5.5V supports varied applications.
Maximum propagation delay time of 1000ns at standard load ensures timely signal handling. Operates reliably from -40°C to 85°C in diverse environments. Very low output current reduces power consumption significantly. ±15kV ESD protection on I/O and VCC lines enhances durability and safety.
Ideal for portable communication devices, cell phones, GPS, and smart card readers. Explore the extensive range of semiconductor logic ICs on EnvMart for more advanced level translation solutions.
Explore more products in our Translator ICs category.
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Frequently Asked Questions
The supply voltage range for this model is from 1.65V to 5.5V.
The maximum propagation delay time is 1000ns at a specified loading of 1000pF.
It operates reliably within a temperature range of -40°C to 85°C.
This model features 8 bi-directional elements.
The device is packaged in a compact 20-pin TSSOP surface mount package.
The maximum low level output current is 2μA, which helps minimize power consumption.
No, it supports bi-directional translation without the need for a directional pin.
It utilizes the BiCMOS logic family technology for efficient performance.
The dimensions are 6.6mm in length and 750μm in height.
It includes ±15kV ESD protection on I/O and VCC lines to safeguard against electrostatic discharge events.
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