Molex Micro-Fit 3.0 Series Straight Through Hole Shrouded 16 Contact Dual Row PCB Header 3 mm Pitch 43045-1624

Molex 43045-1624 Micro-Fit 3.0 Series PCB Header, featuring 16 male contacts with 3 mm pitch in a dual row and shrouded straight through hole configuration, is designed for robust wire-to-board power distribution.

The housing is made from high temperature UL 94V-0 Liquid Crystal Polymer thermoplastic, capable of withstanding up to 265°C during IR reflow soldering, ensuring durability in harsh manufacturing processes.

This PCB header supports up to 5A current at a voltage rating of 250V, making it suitable for compact power distribution solutions in a small footprint. The brass contacts with tin plating ensure reliable electrical performance while reducing costs.

The connector system is wire-to-board with a through hole mount, equipped with metal press-fit retention clips that secure the header firmly to PCB boards, enhancing mechanical stability.

Positive latching via a locking ramp prevents accidental disconnection, providing secure mating in environments subject to vibration or handling.

The connectors are Glow Wire Compliant and have a wide operating temperature range from -40°C to 125°C, supporting applications across industrial, consumer electronics, telecommunications, medical, solar power, and gaming terminals.

Overall, this Micro-Fit 3.0 series header is a versatile and reliable choice for mid-power PCB connectivity, offering high current capacity, secure connections, and ease of integration.

High temperature thermoplastic housing supports IR reflow soldering process. Connectors are shrouded with positive latching for secure mating. Designed to carry up to 5A current at voltage rating of 250V. Features brass contacts with tin plating for reliable conductivity.

Through hole mount type with metal press-fit retention clips for PCB stability. Mating pin length of 3 mm for secure electrical connection. Operating temperature range from -40°C to 125°C for varied environments. Compatible in various low to mid power applications including consumer products, telecommunications, and solar power.

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