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Nexperia 2-Element Uni-Directional ESD Protection Array 200W 3-Pin SOT-23 NUP1301,215

Category ESD Protection Diode Brand Nexperia Condition New

Specifications

Country of Origin China
Brand Nexperia
Height 1.1mm
Length 3mm
Model NUP1301,215
Width 1.4mm
Mount Type Surface
Series NUP
Maximum Operating Temperature 150°C
Package Type SOT-23
Minimum Operating Temperature -55°C
Pin Count 3
Number of Elements per Chip 2
Clamping Voltage VC 20V
Automotive Standard AEC-Q101
Diode Configuration Series
Direction Type Uni-Directional
Minimum Breakdown Voltage Vbr 100V
Maximum Reverse Stand-off Voltage Vwm 80V
Peak Pulse Power Dissipation Pppm 200W
Test Current It 100μA
Maximum Peak Pulse Current Ippm 11A
Maximum Reverse Leakage Current 35μA

Key Features

  • Uni-directional diode configuration in series for effective ESD protection.
  • Offers a minimum breakdown voltage of 100V for reliable operation.
  • Features ultra-low capacitance and surface mount SOT-23 package.
  • Clamping voltage rated at 20V with maximum peak pulse current of 11A.
  • Operates within a temperature range of -55°C to 150°C ensuring durability.
  • Complies with automotive standard AEC-Q101 for robust applications.
  • Maximum reverse stand-off voltage of 80V and reverse leakage current of 35μA.
  • Designed for use in protecting one signal line in rail-to-rail configuration.

Product Description

Nexperia NUP1301,215 2-element uni-directional ESD protection array offers ultra-low capacitance transient voltage suppression tailored for electronic surge protection.

This 3-pin SOT-23 device delivers a peak pulse power dissipation of 200W with a minimum breakdown voltage of 100V, providing reliable transient voltage suppression for sensitive signal lines. The diode series configuration ensures efficient uni-directional ESD protection.

Engineered for use in automotive and industrial applications, it meets the AEC-Q101 standard and operates over a broad temperature range from -55°C to 150°C. Its compact dimensions of 3mm x 1.4mm x 1.1mm allow easy surface mounting on modern PCBs.

The maximum reverse stand-off voltage of 80V and a clamping voltage of 20V allow it to protect devices from voltage spikes and electrostatic discharge events, while maintaining minimal leakage current of 35μA during normal operation.

Uni-directional diode configuration providing ESD protection. 200W peak pulse power capacity with 11A peak pulse current. Surface mount SOT-23 package supports compact assembly. Wide operating temperature range from -55°C to 150°C.

Automotive grade AEC-Q101 compliance ensures reliability. Compact package dimensions suitable for dense PCB layouts. Low leakage current minimizes power loss during normal conditions. Designed specifically for single signal line protection in rail-to-rail circuits.

This component is ideal for use in electronic, communication, automotive, and industrial equipment requiring robust ESD and transient voltage suppression to safeguard sensitive circuitry.

Explore more semiconductor and ESD protection solutions at EnvMart to optimize your electronic designs.

Explore more products in our ESD Protection Diode category.

Nexperia 2-Element Uni-Directional ESD Protection Array 200W 3-Pin SOT-23 NUP1301,215
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Frequently Asked Questions

The Nexperia NUP1301,215 has a peak pulse power dissipation of 200W.

It features a minimum breakdown voltage of 100V, ensuring reliable operation during transient voltage events.

The clamping voltage for this device is rated at 20V.

The maximum reverse stand-off voltage for this model is 80V.

This ESD protection array can handle a maximum peak pulse current of 11A.

It operates within a temperature range of -55°C to 150°C.

The dimensions of the SOT-23 package are 3mm in length, 1.4mm in width, and 1.1mm in height.

The maximum reverse leakage current is 35μA.

Yes, it complies with the automotive standard AEC-Q101, making it suitable for robust applications.

It features a series uni-directional diode configuration for effective ESD protection.

This device has 2 elements per chip.

It is designed for surface mounting, which supports compact assembly on PCBs.

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