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| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Height | 9.65mm |
| Length | 10.67mm |
| Model | IRFS3006TRL7PP |
| Width | 4.83mm |
| Mount Type | Surface |
| Series | HEXFET |
| Maximum Operating Temperature | 175°C |
| Package Type | TO-263 |
| Minimum Operating Temperature | -55°C |
| Pin Count | 8 |
| Channel Type | Type N |
| Maximum Continuous Drain Current Id | 293A |
| Maximum Drain Source Voltage Vds | 60V |
| Maximum Drain Source Resistance Rds | 2.1mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 375W |
| Typical Gate Charge Qg @ Vgs | 200nC |
| Maximum Gate Source Voltage Vgs | 20V |
| Forward Voltage Vf | 1.3V |
Infineon IRFS3006TRL7PP HEXFET N-Channel MOSFET is engineered to deliver high-current handling with robust reliability and efficiency. Combining a continuous drain current of 293A and a maximum drain source voltage of 60V, this enhancement mode MOSFET is well-suited to demanding power supply, motor drive, and switching converter applications.
The IRFS3006TRL7PP features a surface-mount TO-263 package with an 8-pin configuration, optimized for automated assembly processes and high-density PCB layout. Its low drain source resistance of just 2.1mΩ ensures minimal conduction loss, supporting high-efficiency operations in industrial electronic circuits.
Gate-source voltage tolerance of up to 20V allows integration into a broad array of control systems, and the typical gate charge of 200nC enables fast switching capability. The maximum power dissipation of 375W ensures stable performance even under heavy load conditions, while its operational temperature range from -55°C to 175°C makes it suitable for environments with extreme thermal demands.
The HEXFET series from Infineon is recognized for benchmark resistance profiles that drive down energy loss and enhance overall system efficiency. This MOSFET's enhancement mode offers safe and controllable switching, improving device longevity and operational security.
Continuous drain current rated at 293A meets high-power requirements for modern industrial and commercial systems. Ideal for switching power supplies, motor controllers, converters and battery management applications. Low Rds(on) value maximizes power density and minimizes heat generation in circuit boards.
TO-263 package streamlines surface mounting and automated assembly workflows. Suitable for manufacturing, energy infrastructure, automotive electronics, and advanced industrial control.
Designers benefit from the HEXFET series’ adaptability in both surface mount and leaded package types, addressing diverse board layouts and thermal management. The Infineon portfolio further includes CoolMOS, OptiMOS, and StrongIRFET MOSFET families, with quality standards supporting best-in-class performance and protection features.
Explore more Infineon HEXFET MOSFETs and discover solutions for your industrial, laboratory, and electronics applications on EnvMart.
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