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IXYS GigaMOS Trench HiperFET N-Channel Power MOSFET 100 V, 360 A, 830 W, SOT-227 Package IXFN360N10T

Category Power MOSFET Brand IXYS Condition New

Specifications

Country of Origin India
Brand IXYS
Height 9.6mm
Length 38.23mm
Model IXFN360N10T
Width 25.07mm
Mount Type Surface
Series GigaMOS Trench HiperFET
Maximum Operating Temperature 175°C
Package Type SOT-227
Minimum Operating Temperature -55°C
Pin Count 4
Channel Type N
Maximum Continuous Drain Current Id 360A
Maximum Drain Source Voltage Vds 100V
Maximum Drain Source Resistance Rds 2.6mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 830W
Typical Gate Charge Qg @ Vgs 525nC
Maximum Gate Source Voltage Vgs -20, +20V
Forward Voltage Vf 1.2V

Key Features

  • High maximum continuous drain current of 360 amperes.
  • Durable surface mount SOT-227 package for efficient heat dissipation.
  • Maximum power dissipation of 830 watts suitable for high power applications.
  • Low on-resistance of 2.6 milliohms for reduced conduction losses.
  • Operates reliably in temperatures from -55°C to 175°C.
  • Typical gate charge of 525 nanocoulombs conducive for high-speed switching.
  • Maximum gate-source voltage rating is ±20 volts for robust gate control.
  • Enhancement mode channel with N-type conduction channel.

Product Description

IXYS IXFN360N10T is a high-performance GigaMOS Trench HiperFET N-Channel Power MOSFET designed for demanding power electronics applications. Featuring a maximum continuous drain current of 360 A and a maximum drain-source voltage of 100 V, it is engineered for high current conduction and efficient switching.

This MOSFET comes in a robust 4-pin SOT-227 surface mount package optimized for heat dissipation and mechanical stability. The device offers a maximum power dissipation rating of 830 W, enabling reliable operation under heavy loads. It has an exceptionally low on-state resistance (Rds(on)) of 2.6 milliohms, significantly lowering conduction losses and improving system efficiency.

The device's gate is designed for enhancement mode operation with a typical gate charge of 525 nC at 5 V gate drive, facilitating high-speed switching in power circuits. The maximum gate-source voltage tolerance of ±20 V ensures reliable gate control without risk of damage. It supports operating temperatures ranging from -55°C up to 175°C, making it suitable for industrial electronics environments.

Compact physical dimensions (38.23 mm length, 25.07 mm width, and 9.6 mm height) make this MOSFET adaptable for space-constrained designs. The forward voltage drop of 1.2 V aids in efficient power conversion with reduced losses.

This product is ideal for industrial, power management, automotive electronics, and other applications requiring robust high current switching capability with high efficiency. IXYS GigaMOS technology ensures advanced performance and durability.

High maximum continuous drain current of 360 amperes. Durable 4-pin SOT-227 surface mount package optimized for heat dissipation. Maximum power dissipation rating of 830 Watts allows handling heavy power loads. Low on-resistance of 2.6 milliohms reduces conduction losses significantly.

Wide operating temperature range from -55°C to 175°C suited for harsh environments. Fast switching enabled by a typical gate charge of 525 nanocoulombs. Robust ±20 V gate-source voltage rating offers reliable gate control.

Compact dimensions conducive for industrial PCB layouts. Enhancement mode N-channel for high performance switching. Forward voltage drop of 1.2 V supports efficient power system design. Explore more Power MOSFETs and semiconductor devices in the Electronics & Electricals category at EnvMart for your industrial, automotive, and commercial electronic design needs.

IXYS GigaMOS Trench HiperFET N-Channel Power MOSFET 100 V, 360 A, 830 W, SOT-227 Package IXFN360N10T
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Frequently Asked Questions

The IXFN360N10T has a maximum continuous drain current of 360 A, making it suitable for high current applications.

This model has a maximum power dissipation rating of 830 W, allowing it to handle heavy power loads efficiently.

It features a low on-resistance of 2.6 milliohms, which helps to reduce conduction losses significantly.

The device operates reliably in temperatures ranging from -55°C to 175°C, making it suitable for harsh environments.

The IXFN360N10T comes in a durable 4-pin SOT-227 surface mount package, optimized for heat dissipation.

It has a typical gate charge of 525 nanocoulombs, which facilitates high-speed switching in power circuits.

The maximum gate-source voltage rating is ±20 volts, ensuring robust gate control without risk of damage.

This model has dimensions of 38.23 mm in length, 25.07 mm in width, and 9.6 mm in height.

The forward voltage drop is 1.2 V, which aids in efficient power conversion with reduced losses.

It features an enhancement mode N-channel, designed for high-performance switching applications.

This model is part of the GigaMOS Trench HiperFET series, which is known for advanced performance in power electronics.

It is ideal for industrial, power management, and automotive electronics applications requiring high current switching capability.

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