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| Country of Origin | India |
|---|---|
| Brand | onsemi |
| Height | 1.5mm |
| Length | 5mm |
| Model | FDS6681Z |
| Width | 4mm |
| Mount Type | Surface |
| Series | PowerTrench |
| Maximum Operating Temperature | 150°C |
| Package Type | SOIC |
| Minimum Operating Temperature | -55°C |
| Pin Count | 8 |
| Channel Type | Type P |
| Maximum Continuous Drain Current Id | 20A |
| Maximum Drain Source Voltage Vds | 30V |
| Maximum Drain Source Resistance Rds | 5mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 2.5W |
| Typical Gate Charge Qg @ Vgs | 185nC |
| Maximum Gate Source Voltage Vgs | -25, +25V |
| Forward Voltage Vf | -1.2V |
onsemi FDS6681Z PowerTrench Type P-Channel MOSFET is engineered for high efficiency and power density applications. Rated for a maximum continuous drain current of 20 A and a drain-source voltage of 30 V, this device is housed in an 8-pin SOIC surface-mount package measuring 5 mm by 4 mm by 1.5 mm. It employs a shielded-gate PowerTrench technology that ensures low gate charge and fast switching capabilities, ideal for synchronous rectification in AC/DC power supplies.
The enhancement mode MOSFET features a very low on-resistance of 5 milliohms, which minimizes conduction losses. The device can operate reliably within a temperature range from -55°C to 150°C, making it suitable for a variety of industrial and commercial semiconductor applications.
The robust design includes a soft recovery body diode, which facilitates soft switching and reduces electromagnetic interference, often eliminating the need for snubber circuits or higher voltage MOSFETs. The maximum power dissipation is 2.5 W, complementing its compact size.
This component supports gate-source voltages up to ±25 V and exhibits a forward voltage drop of approximately -1.2 V. The typical gate charge is 185 nC, contributing to efficient switching dynamics. It does not carry automotive standards approvals.
This PowerTrench P-Channel MOSFET offers system efficiency improvements and enhanced power density. Its shielded-gate design balances charge for reduced figure of merit (FOM) versus previous generations. Soft body diode function improves switching performance and circuit protection.
Compact SOIC package provides excellent board space savings for surface mount assembly. Operating temperature range supports demanding industrial and commercial electronics environments. Low Rds(on) and gate charge reduce loss and improve power conversion efficiency.
Suitable for industrial, electronic component manufacturing, power supply circuits, and semiconductor replacement projects. Discover more onsemi MOSFET devices and power management semiconductor solutions on EnvMart for optimized electronics applications.
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