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| Country of Origin | India |
|---|---|
| Brand | onsemi |
| Height | 940μm |
| Length | 2.92mm |
| Model | FDN360P |
| Width | 1.4mm |
| Mount Type | Surface |
| Series | PowerTrench |
| Maximum Operating Temperature | 150°C |
| Package Type | SOT-23 |
| Minimum Operating Temperature | -55°C |
| Pin Count | 3 |
| Channel Type | Type P |
| Maximum Continuous Drain Current Id | 2A |
| Maximum Drain Source Voltage Vds | 30V |
| Maximum Drain Source Resistance Rds | 80mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 500mW |
| Typical Gate Charge Qg @ Vgs | 6.2nC |
| Maximum Gate Source Voltage Vgs | -20, +20V |
| Forward Voltage Vf | -1.2V |
onsemi FDN360P PowerTrench Type P-Channel MOSFET, model FDN360P, is a high-performance discrete semiconductor designed for power switching applications at 30 V and 2 A ratings. It comes in a compact 3-pin SOT-23 surface-mount package, enabling its integration into various electronic devices requiring efficient power management.
The device incorporates advanced PowerTrench® technology with a shielded-gate structure that significantly lowers the figure of merit (FOM), enhancing system efficiency and power density. Its low gate charge and soft reverse recovery body diode contribute to minimal switching losses and electromagnetic interference, making it ideal for synchronous rectification in AC/DC power supplies.
This P-Channel enhancement mode MOSFET supports a maximum continuous drain current of 2 A and a maximum drain-source voltage of 30 V. It operates reliably across a wide temperature spectrum from -55°C up to 150°C, with a maximum power dissipation rating of 500 mW for thermal robustness.
The device’s compact dimensions (2.92 mm length, 1.4 mm width, and 940 µm height) make it suitable for modern compact electronics. Typical gate charge at Vgs is 6.2 nC, with a maximum gate-source voltage rating of ±20 V. The maximum drain-source resistance is 80 mΩ, balancing conduction efficiency and thermal performance.
Optimized power switching capabilities via PowerTrench® design. Shielded-gate structure for superior charge balance and fast switching. Surface-mount SOT-23 package ensuring easy PCB integration. Wide operating temperature and voltage range for diverse applications.
Reliable forward voltage and body diode characteristics reduce snubber components.
Applications include industrial power management, consumer electronics, automotive electronics non-compliant with automotive standard, and other power conversion systems benefitting from efficient low-voltage MOSFET switching. The device’s compact size and performance make it an excellent choice for enhancing the efficiency of power electronic designs.
Explore more components in the Semiconductor and MOSFET categories on EnvMart to find compatible and complementary devices suited for your application needs.
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