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onsemi PowerTrench Type P-Channel MOSFET, 11 A, 30 V Enhancement, 8-Pin SOIC FDS6675BZ

Category MOSFET Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 1.5mm
Length 5mm
Model FDS6675BZ
Width 4mm
Mount Type Surface
Series PowerTrench
Maximum Operating Temperature 150°C
Package Type SOIC
Minimum Operating Temperature -55°C
Pin Count 8
Channel Type Type P
Maximum Continuous Drain Current Id 11A
Maximum Drain Source Voltage Vds 30V
Maximum Drain Source Resistance Rds 13mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 2.5W
Typical Gate Charge Qg @ Vgs 44nC
Maximum Gate Source Voltage Vgs -25, +25V
Forward Voltage Vf -1.2V
P-Channel MOSFET Transistor, 17 A, 30 V, 8-Pin SOIC Diodes Inc ZXMP3F35N8TABrand DiodesZetex

Key Features

  • PowerTrench® technology provides enhanced system power efficiency.
  • Low typical gate charge of 44 nC enables fast switching performance.
  • Maximum drain-source resistance of 13 milliohms ensures low conduction losses.
  • Operates over a wide temperature range from -55°C to 150°C.
  • Compact SOIC package measures 5 mm length, 4 mm width, and 1.5 mm height.
  • Maximum power dissipation rating of 2.5 Watts supports reliable operation.
  • Surface mount design suitable for automated PCB assembly.
  • Soft reverse recovery body diode reduces switching noise and power losses.

Product Description

onsemi FDS6675BZ PowerTrench Type P-Channel Enhancement Mode MOSFET is engineered for industrial and commercial electronic applications requiring efficient power switching. The device features a maximum continuous drain current of 11 A and a maximum drain-source voltage of 30 V, delivered in a compact 8-pin SOIC surface mount package measuring 5 mm x 4 mm x 1.5 mm.

Utilizing PowerTrench® technology, this MOSFET offers a low typical gate charge of 44 nC and an exceptionally low on-resistance of 13 mΩ, resulting in reduced conduction losses and enhanced switching efficiencies. The device supports a wide operating temperature range from -55°C to 150°C, making it suitable for demanding environments.

The FDS6675BZ incorporates a shielded-gate structure to balance charge and improve figure of merit (FOM), benefiting synchronous rectification in AC/DC power supplies. Its soft reverse recovery body diode enables elimination of snubber circuits or downsizing of MOSFET ratings in power management designs.

Designed for surface mount technology (SMT), this MOSFET ensures ease of integration on PCBs for power supply, motor control, and switching applications across industrial, manufacturing, automotive, and consumer electronics sectors.

PowerTrench® technology delivers increased system efficiency and power density. Low gate charge enhances switching speed and reduces losses. Soft body diode reduces electromagnetic interference and power dissipation. Wide operating temperature range supports harsh industrial environments.

Compact SOIC 8-pin package fits automated assembly lines. Surface mount mount type suitable for modern electronic designs. Voltage ratings ideal for 30 V power management systems. Robust gate voltage tolerance ±25 V enhances reliability.

Typical forward voltage of -1.2 V contributes to stable conduction characteristics.

This product is classified under Electronics & Electricals > Semiconductor > MOSFET, making it a key component for electronics engineers and system designers. Explore the wide range of onsemi products available on EnvMart for advanced semiconductor solutions.

onsemi PowerTrench Type P-Channel MOSFET, 11 A, 30 V Enhancement, 8-Pin SOIC FDS6675BZ
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Frequently Asked Questions

The maximum continuous drain current for this model is 11 A.

This MOSFET has a maximum drain-source voltage rating of 30 V.

The typical gate charge for the FDS6675BZ is 44 nC.

The maximum drain-source resistance for this model is 13 milliohms.

The SOIC package measures 5 mm in length, 4 mm in width, and 1.5 mm in height.

This MOSFET operates over a wide temperature range from -55°C to 150°C.

The maximum power dissipation rating for this unit is 2.5 Watts.

The FDS6675BZ supports surface mount technology (SMT).

The typical forward voltage for this model is -1.2 V.

The maximum gate-source voltage tolerance for this MOSFET is ±25 V.

This model utilizes PowerTrench® technology to enhance system power efficiency.

The FDS6675BZ is manufactured in India.

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