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| Country of Origin | China |
|---|---|
| Brand | Infineon |
| Height | 4.83mm |
| Length | 10.67mm |
| Model | IRF3205STRLPBF |
| Width | 9.65mm |
| Mount Type | Surface |
| Series | HEXFET |
| Maximum Operating Temperature | 175°C |
| Package Type | TO-263 |
| Minimum Operating Temperature | -55°C |
| Pin Count | 3 |
| Channel Type | Type N |
| Maximum Continuous Drain Current Id | 110A |
| Maximum Drain Source Voltage Vds | 55V |
| Maximum Drain Source Resistance Rds | 8mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 200W |
| Typical Gate Charge Qg @ Vgs | 146nC |
| Maximum Gate Source Voltage Vgs | 20V |
| Forward Voltage Vf | 1.3V |
Infineon IRF3205STRLPBF is a high-performance N-Channel Power MOSFET from Infineon's HEXFET series. This enhancement mode MOSFET is tailored for power switching applications with a maximum continuous drain current of 110 A and a drain-source voltage rating of 55 V. The device comes housed in a 3-pin TO-263 surface mount package, which allows efficient heat dissipation and easy board integration.
This MOSFET features low on-resistance, with a typical Rds(on) of 8 mΩ, minimizing conduction losses and improving system efficiency. The forward voltage drop of 1.3 V supports low voltage drop applications, while the typical gate charge of 146 nC enables fast switching performance. Maximum gate-source voltage is limited to ±20 V to protect gate integrity during operation.
Rated for continuous operation between -55°C and 175°C, this MOSFET offers robust thermal margins, suitable for demanding industrial and power electronics environments. The compact dimensions of the TO-263 package measure 10.67 mm in length, 9.65 mm in width, and 4.83 mm in height, supporting space-constrained designs.
Although not AEC-Q101 automotive certified, this device is optimized for efficiency in applications including power supplies, motor drives, DC-DC converters, and general purpose switching. ROHS compliant, manufactured in China, the IRF3205STRLPBF provides reliable performance from an industry-leading semiconductor brand.
This product is ideal for electrical engineering projects requiring high current and voltage capabilities. Its HEXFET technology reduces power losses and heat generation, increasing system lifespan. Commonly used in industrial automation, consumer electronics, and HVAC control systems.
The TO-263 package allows for enhanced thermal management when paired with suitable heat sinking. Enables design teams to achieve higher power density and efficiency in compact formats. Browse more semiconductor components and Infineon products at EnvMart.
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