Taiwan Semiconductor General Purpose PNP Transistor BC807-25 RF, -500 mA, -45 V, 3-Pin SOT-23

Taiwan Semiconductor BC807-25 RF is a general purpose PNP transistor designed for use in various electronic and industrial applications. It is housed in a compact 3-pin SOT-23 surface mount package that supports efficient PCB mounting and space-saving designs.

This transistor can handle a maximum DC collector current of -500 mA and offers a collector-emitter voltage (Vceo) of -45 V, making it suitable for moderate power amplification and switching tasks. It provides a maximum power dissipation of 300 mW to ensure stable operation under load.

The device features a minimum DC current gain (hFE) of 160, which is beneficial for amplification purposes. It also supports a maximum transition frequency of 100 MHz, allowing use in moderately high-frequency switching circuits.

Its operational temperature range spans from -55°C to 150°C, making it versatile for use in various industrial environments, including electronics manufacturing, instrumentation, and embedded systems.

The BC807-25 RF transistor's configuration is a single PNP type with 3 pins, ideal for designing amplifiers, signal processing circuits, and other electronic modules requiring reliable bipolar transistor performance.

Compact SOT-23 package for efficient surface mounting. Maximum collector current of -500 mA for versatile applications. Collector-emitter voltage rating of -45 V supports moderate power circuitry. Maximum power dissipation rated at 300 mW enhances durability.

High minimum current gain (hFE) of 160 for effective amplification. Wide temperature range from -55°C to 150°C suitable for industrial use. High transition frequency of 100 MHz enables use in switching circuits. Single PNP transistor design with 3 pins in SOT-23 footprint.

This transistor is commonly employed in industrial, laboratory, and commercial electronic applications where small signal bipolar transistors with moderate voltage and current ratings are required. Its surface mount design ensures optimal integration in compact and automated PCB assembly processes.

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