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| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Length | 6.42mm |
| Model | IPLK80R900P7ATMA1 |
| Mount Type | Surface |
| Series | IPL |
| Maximum Operating Temperature | 150°C |
| Package Type | ThinPAK 5x6 |
| Minimum Operating Temperature | -55°C |
| Standards/Approvals | RoHS |
| Pin Count | 5 |
| Automotive Standard | AEC-Q101 |
| Channel Type | N |
| Maximum Continuous Drain Current Id | 4.5A |
| Maximum Drain Source Voltage Vds | 800V |
| Maximum Drain Source Resistance Rds | 1.2mΩ |
| Maximum Power Dissipation Pd | 43W |
| Typical Gate Charge Qg @ Vgs | 80nC |
| Maximum Gate Source Voltage Vgs | 3V |
| Forward Voltage Vf | 900mV |
Infineon IPLK80R900P7ATMA1 is a high-performance N-Channel MOSFET designed for demanding power electronics applications. It supports a continuous drain current of 4.5 A and a maximum drain-source voltage of 800 V, making it ideal for flyback converter designs including adapters, chargers, audio SMPS, auxiliary power, and industrial power supplies.
This MOSFET delivers up to 0.6% efficiency improvement and achieves a reduction in operating temperature by 2°C to 8°C compared to earlier generation and competitor devices, thus ensuring better reliability and energy savings. Its superior Figure of Merit (FOM) RDS(on) and reduced gate charge (80 nC at Vgs) lead to lower switching losses, improving overall system efficiency.
Infineon’s ThinPAK 5x6 package is characterized by a compact 5x6 mm² footprint and only 1 mm profile height, allowing designers to create smaller, denser power solutions with high power density. Additionally, the integrated Zener diode provides enhanced electrostatic discharge (ESD) protection, and the device meets automotive standard AEC-Q101 and RoHS compliance for industrial and automotive use.
Best-in-class RDS(on) and minimized gate charge reduce conduction and switching losses. Low forward voltage drop of 900 mV improves efficiency under load conditions. Wide operating temperature range: -55°C to 150°C enables robust performance in harsh environments.
5-pin surface mount ThinPAK 5x6 package supports automated assembly processes. Designed for flyback applications with optimized low EMI properties to improve system electromagnetic compatibility.
This MOSFET is suitable for industrial electronics, power supplies, audio amplifiers, and automotive applications requiring efficient, compact, and reliable switching components. It helps reduce bill of materials (BOM) cost and assembly effort while delivering enhanced performance.
Explore more in the MOSFET category on EnvMart for similar power management solutions and components for your electronic design needs.
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