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onsemi Isolated PowerTrench 2 Type N, Type P-Channel MOSFET, 3.8 A, 20 V Enhancement, 6-Pin MicroFET FDME1034CZT

Category MOSFET Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 0.5mm
Length 1.6mm
Model FDME1034CZT
Width 1.6mm
Mount Type Surface
Series PowerTrench
Maximum Operating Temperature 150°C
Package Type MicroFET
Minimum Operating Temperature -55°C
Pin Count 6
Number of Elements per Chip 2
Channel Type Type N, Type P
Maximum Continuous Drain Current Id 3.8A
Maximum Drain Source Voltage Vds 20V
Maximum Drain Source Resistance Rds 530mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 1.4W
Typical Gate Charge Qg @ Vgs 3nC
Maximum Gate Source Voltage Vgs -8, +8V
Forward Voltage Vf 0.7V
Transistor Configuration Isolated

Key Features

  • This MOSFET features PowerTrench® 2 technology for efficient switching performance.
  • The device has a package type of 6-pin MicroFET facilitating easy surface mounting.
  • Maximum power dissipation is rated at 1.4 W, suitable for moderate power applications.
  • It supports a maximum gate-source voltage of -8 to +8 V with low gate charge of 3 nC for fast switching.
  • Operates reliably in a wide temperature range from -55°C to 150°C.
  • Its isolated transistor configuration incorporates dual N and P channel MOSFETs on one chip.
  • The device exhibits a maximum drain-source resistance of 530 mΩ improving conduction efficiency.
  • Designed without automotive standard certification, suitable for general electronic power and signal switching.

Product Description

onsemi FDME1034CZT Isolated PowerTrench 2 Type N and Type P-Channel MOSFET is engineered as a pair of dual MOSFETs in a single 6-pin MicroFET package designed for surface mount technology applications. It features a maximum continuous drain current of 3.8 amperes and can withstand up to 20 volts drain-source voltage ensuring robust operation in various power switching circuits.

Constructed with PowerTrench® technology, these MOSFETs combine small gate charge and soft reverse recovery body diode characteristics allowing fast switching with reduced power losses, enhancing overall system efficiency and power density. The shielded-gate structure balances charge to achieve an improved figure of merit and better switching performance compared to previous generations.

The isolated transistor configuration includes both N-channel and P-channel devices on the same chip, enabling complementary switching arrangements. Its low forward voltage (0.7 V) and moderate power dissipation (1.4 W) make it ideal for synchronous rectification in AC/DC power supplies and other power management applications.

Physical dimensions of 1.6 mm x 1.6 mm x 0.5 mm facilitate compact circuit design. Operating temperature range from -55°C to 150°C supports reliability in demanding industrial and commercial environments. The device is not certified for automotive use but is broadly applicable in electronic components for power and signal modulation.

Key performance parameters include a maximum gate-source voltage range from -8 to +8 V and a low typical gate charge of 3 nC enabling responsive gate control and energy-efficient switching. The maximum drain-source resistance of 530 mΩ helps limit conduction losses in circuits.

onsemi’s PowerTrench MOSFET series provides advanced power switching solutions suited for industrial, electronic manufacturing, HVAC, and general electronics applications requiring efficient, reliable power transistors with dual-channel capabilities.

This MOSFET features PowerTrench® 2 technology for efficient switching performance. The device has a package type of 6-pin MicroFET facilitating easy surface mounting. Maximum power dissipation is rated at 1.4 W, suitable for moderate power applications.

It supports a maximum gate-source voltage of -8 to +8 V with low gate charge of 3 nC for fast switching. Operates reliably in a wide temperature range from -55°C to 150°C. Its isolated transistor configuration incorporates dual N and P channel MOSFETs on one chip.

The device exhibits a maximum drain-source resistance of 530 mΩ improving conduction efficiency. Dimensions are compact, measuring 1.6 mm in length and width and 0.5 mm in height. Designed without automotive standard certification, suitable for general electronic power and signal switching.

Explore our broad range of semiconductor MOSFETs and power transistors on EnvMart to find compatible components for your power management and electronic design projects.

onsemi Isolated PowerTrench 2 Type N, Type P-Channel MOSFET, 3.8 A, 20 V Enhancement, 6-Pin MicroFET FDME1034CZT
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Frequently Asked Questions

The maximum continuous drain current for this model is 3.8 A.

It can withstand a maximum drain-source voltage of 20 V.

This MOSFET comes in a 6-pin MicroFET package, designed for surface mounting.

The typical gate charge is 3 nC, allowing for fast switching performance.

The maximum power dissipation is rated at 1.4 W.

It operates reliably in a temperature range from -55°C to 150°C.

The maximum gate-source voltage is from -8 V to +8 V.

The maximum drain-source resistance is 530 mΩ, which improves conduction efficiency.

The forward voltage is 0.7 V.

The isolated configuration incorporates both N-channel and P-channel MOSFETs on one chip, enabling complementary switching arrangements.

This model is suitable for general electronic power and signal switching applications, including synchronous rectification in AC/DC power supplies.

The physical dimensions are 1.6 mm x 1.6 mm x 0.5 mm.

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