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onsemi PowerTrench Type P-Channel MOSFET 1.3 A 30 V Enhancement 3-Pin SOT-23 FDN352AP

Category Power MOSFET Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 940μm
Length 2.92mm
Model FDN352AP
Width 1.4mm
Mount Type Surface
Series PowerTrench
Maximum Operating Temperature 150°C
Package Type SOT-23
Minimum Operating Temperature -55°C
Pin Count 3
Channel Type Type P
Maximum Continuous Drain Current Id 1.3A
Maximum Drain Source Voltage Vds 30V
Maximum Drain Source Resistance Rds 180mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 500mW
Typical Gate Charge Qg @ Vgs 1.4nC
Maximum Gate Source Voltage Vgs -25, +25V
Forward Voltage Vf -1.2V

Key Features

  • Features a low maximum drain-source resistance of 180 mΩ for efficient switching.
  • Employs PowerTrench technology optimized for enhanced system efficiency and power density.
  • Supports a wide operating temperature range from -55°C to 150°C.
  • Includes a shielded-gate structure for improved charge balance and reduced figure of merit.
  • Designed with a soft reverse recovery body diode to eliminate snubber circuits in power supply applications.
  • Typical gate charge is 1.4 nC at Vgs, enabling fast switching performance.
  • Maximum power dissipation rating of 500 mW for reliable operation.
  • Suitable for surface mount applications in electronic and power management systems.

Product Description

onsemi FDN352AP PowerTrench Type P-Channel MOSFET is a compact and efficient semiconductor device designed for power switching applications. Rated at a maximum continuous drain current of 1.3 A and a drain-source voltage of 30 V, this enhancement mode MOSFET is housed in a 3-pin SOT-23 surface mount package, making it ideal for space-constrained electronic circuits.

The PowerTrench® technology integrated into this MOSFET provides low on-resistance and improved switching performance by utilizing a shielded-gate design. This results in a lower figure of merit compared to previous generations, enhancing overall system efficiency.

The device features a soft reverse recovery body diode, reducing the need for additional snubber circuits or higher voltage ratings in MOSFET replacements. Typical gate charge of 1.4 nC at the gate-source voltage ensures rapid switching capabilities vital in synchronous rectification of AC/DC power supplies and other power management applications.

Operating reliably across a temperature range from -55°C to 150°C, the FDN352AP is suitable for demanding industrial, commercial, and automotive environments. Its package dimensions measure 2.92 mm in length, 1.4 mm in width, and a height of 940 μm, enabling high-density mounting on printed circuit boards.

Compact 3-pin SOT-23 surface mount package. Maximum continuous drain current of 1.3 A at 30 V drain-source voltage. Enhanced switching with PowerTrench technology and low on-resistance. Soft body diode eliminates snubber circuits.

Wide operating temperature from -55°C to 150°C. Typical gate charge of 1.4 nC enables fast switching. Maximum power dissipation of 500 mW. Precision package dimensions for PCB integration.

This MOSFET is widely utilized in electronic components, power supplies, and semiconductor applications within the industrial and commercial sectors. It offers reliable performance and efficient power management suitable for both new designs and upgrades. Find accurate and trusted electronic components like this onsemi FDN352AP MOSFET at EnvMart.

Explore more products in our Power MOSFET category.

onsemi PowerTrench Type P-Channel MOSFET 1.3 A 30 V Enhancement 3-Pin SOT-23 FDN352AP
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Frequently Asked Questions

The FDN352AP has a maximum continuous drain current of 1.3 A.

This model has a maximum drain-source voltage rating of 30 V.

The typical gate charge at Vgs for the FDN352AP is 1.4 nC.

The dimensions of the SOT-23 package are 2.92 mm in length, 1.4 mm in width, and 940 μm in height.

The maximum power dissipation rating for the FDN352AP is 500 mW.

It can operate reliably across a temperature range from -55°C to 150°C.

This model supports surface mounting.

The maximum drain-source resistance is 180 mΩ.

It features a Type P channel.

The forward voltage for the body diode is -1.2 V.

PowerTrench technology enhances system efficiency and power density by providing low on-resistance and improved switching performance.

This MOSFET is suitable for electronic components, power supplies, and semiconductor applications within industrial and commercial sectors.

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