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| Country of Origin | India |
|---|---|
| Voltage | 250V |
| Brand | Molex |
| Orientation | Right Angle |
| Current | 5A |
| Mount Type | Through Hole |
| Housing Material | Thermoplastic |
| Contact Material | Brass |
| Series | Micro-Fit 3.0 |
| Termination Type | Solder |
| Maximum Operating Temperature | 105°C |
| Minimum Operating Temperature | -40°C |
| Number of Rows | 1 |
| Pitch | 3mm |
| Contact Plating | Tin |
| Number of Contacts | 5 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Shrouded |
| Connector System | Wire-to-Board |
Molex 43650-0500 Micro-Fit 3.0 Series Right Angle Through Hole PCB Header is designed for compact power distribution with a reliable 5 contact configuration and 3 mm pitch in a shrouded, single-row assembly.
This PCB header supports a current rating of 5A, making it suitable for low to mid-range power applications. The housing is fabricated from thermoplastic material that meets UL 94V-0 standards and tolerates high temperatures up to 265°C during the IR reflow soldering process. The male brass contacts offer durable conductivity with tin plating to balance performance and cost.
The connector features a right angle orientation optimized for through hole PCB mounting, and snap-in plastic peg locks ensure firm mechanical stability on the board. Positive latching design prevents accidental disconnections, enhancing the connector’s reliability in various industrial applications.
Operating temperatures range from -40°C to 105°C, making this header suitable for demanding environments such as military commercial off-the-shelf (COTS) electronics, solar power installations, consumer appliances, telecommunications equipment, medical devices, data communications hardware, and gaming terminals.
Micro-Fit 3.0 connectors are noted for their high current capacity within a minimal footprint, delivering efficient wire-to-board power connections. The fully isolated dual beam terminals reduce arcing risk, promoting safety and reliability in critical installations.
Supports up to 5A current carrying capacity. Constructed with thermoplastic housing for high temperature resistance. Features brass contacts plated with tin for reliable conductivity. Right angle orientation with through hole mount type for PCB integration.
Includes positive latching and plastic peg PCB locks for secure connection. Operates within temperature range from -40°C to 105°C. Designed for wire-to-board connector system applications. Compatible with IR reflow soldering process due to high temperature UL 94V-0 Liquid Crystal Polymer housing material.
This Molex Micro-Fit 3.0 Series PCB Header is ideal for integration in industrial electronics, manufacturing assemblies, laboratory instrumentation, HVAC systems, and commercial electrical products. It is part of a versatile connector family recognized for high performance, compact size, and reliability.
Explore more PCB Headers and Micro-Fit connectors in EnvMart’s extensive electronics components catalog to find the right solution for your power distribution needs.
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