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| Country of Origin | India |
|---|---|
| Brand | onsemi |
| Height | 1.5mm |
| Length | 5mm |
| Model | FDS4559 |
| Width | 4mm |
| Mount Type | Surface |
| Series | PowerTrench |
| Maximum Operating Temperature | 175°C |
| Package Type | SOIC |
| Minimum Operating Temperature | -55°C |
| Pin Count | 8 |
| Number of Elements per Chip | 2 |
| Channel Type | Type P, Type N |
| Maximum Continuous Drain Current Id | 4.5A |
| Maximum Drain Source Voltage Vds | 60V |
| Maximum Drain Source Resistance Rds | 55mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 2W |
| Typical Gate Charge Qg @ Vgs | 12.5nC |
| Maximum Gate Source Voltage Vgs | -20, +20V |
| Forward Voltage Vf | 0.8V |
| Transistor Configuration | Isolated |
onsemi FDS4559 is an Isolated PowerTrench dual MOSFET that includes both Type P and Type N channel transistors designed for high efficiency and power density in electronic circuits. This enhancement mode device is rated for a continuous drain current of 4.5 A and a maximum drain-source voltage of 60 V, making it well-suited for power switching applications.
The MOSFET is supplied in a compact 8-pin SOIC surface mount package with overall dimensions measuring 5 mm in length, 4 mm in width, and 1.5 mm in height, allowing it to fit into high-density circuit boards. The device features a maximum drain-source resistance of 55 milliohms, contributing to low on-state losses and improved efficiency.
With a typical gate charge of 12.5 nC and gate-source voltage tolerance between -20 V and +20 V, the FDS4559 offers fast switching capabilities essential for synchronous rectification in power supplies. Its power dissipation limit is 2 watts and it operates reliably in a temperature range from -55°C up to 175°C, suitable for industrial and commercial use cases.
The isolated transistor configuration provides superior circuit segregation and helps reduce electromagnetic interference. This product is ideal for applications in power management, industrial electronics, communication equipment, and other environments requiring robust discrete semiconductor devices.
This MOSFET features an enhancement-mode configuration that improves switching performance. Maximum continuous drain current is rated at 4.5 amperes for reliable operation. The device supports a maximum drain-source voltage of 60 volts ensuring suitability for various power applications.
It offers a low maximum drain-source resistance of 55 milliohms, enhancing efficiency. Maximum gate-source voltage ranges from -20 to +20 volts for robust gate control. Typical gate charge is only 12.5 nanocoulombs at Vgs, promoting fast switching.
Power dissipation capacity is 2 watts with an operating temperature range from -55 to 175°C. Compact dimensions of 5 mm length, 4 mm width, and 1.5 mm height support integration in space-constrained designs. The isolated transistor configuration enhances circuit isolation and thermal management.
Pin count of 8 pins supports complex dual MOSFET arrangements. Explore the range of onsemi semiconductor components for other power management and discrete electronic applications available on EnvMart.
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