Molex SL Series Vertical Through Hole PCB Header 5 Contacts 2.54 mm Pitch 1 Row Shrouded 70543-0004

Molex 70543-0004 is a SL Series vertical through hole PCB header designed for wire-to-board connectivity in various electronic applications. Featuring 5 gold-plated contacts with a 2.54 mm pitch and a shrouded 1-row configuration, this connector provides reliable and durable electrical connections suitable for demanding industrial environments.

The housing is made from glass filled polyester, ensuring strong mechanical integrity, while the brass and phosphor bronze contacts with gold plating enhance conductivity and corrosion resistance. Operating within temperatures ranging from -40°C to 105°C, this PCB header supports a voltage rating of 250V and a current rating of 3A.

Its solder termination type and through-hole mount design make it compatible with standard wave soldering processes, including lead-free soldering. The tail pin length of 3.3 mm and mating pin length of 6.1 mm optimize installation ease and connector mating reliability.

This connector is widely used for signal connections in control systems, interconnecting PCBs in consumer electronics, and in automation and robotics equipment where dependable performance is critical. Its shrouded profile minimizes risk of misalignment and accidental pin damage, providing long-term usability rated for up to 50 mating cycles.

5 gold-plated brass/phosphor bronze contacts ensure reliable connectivity. Glass filled polyester housing provides mechanical strength and durability. Shrouded 1-row vertical design enables secure mating and alignment. High operating voltage of 250V and current rating of 3A suits diverse applications.

Through hole mounting with solder termination supports wave and lead-free soldering. Temperature rating from -40°C to 105°C for industrial environments. Tail pin length 3.3mm and mating pin length 6.1mm optimize soldering and mating.

This Molex SL Series PCB header is an essential component for industrial, manufacturing, automation, telecommunications, and consumer electronics applications. It enhances signal integrity and ensures dependable connections in complex PCB assemblies.

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