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onsemi PowerTrench Type P-Channel MOSFET Surface Mount 1.3 A 30 V 3-Pin SOT-23 FDN352AP

Category MOSFET Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 940μm
Length 2.92mm
Model FDN352AP
Width 1.4mm
Mount Type Surface
Series PowerTrench
Maximum Operating Temperature 150°C
Package Type SOT-23
Minimum Operating Temperature -55°C
Pin Count 3
Channel Type Type P
Maximum Continuous Drain Current Id 1.3A
Maximum Drain Source Voltage Vds 30V
Maximum Drain Source Resistance Rds 180mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 500mW
Typical Gate Charge Qg @ Vgs 1.4nC
Maximum Gate Source Voltage Vgs -25, +25V
Forward Voltage Vf -1.2V

Key Features

  • PowerTrench technology offers enhanced efficiency and reduced switching losses.
  • Maximum continuous drain current of 1.3 amperes suitable for low power applications.
  • Low maximum drain-source resistance of 180 milliohms for better conduction.
  • Compact surface mount SOT-23 package with 3 pins enables space saving on PCB.
  • Operating temperature range from -55°C to 150°C for reliable performance.
  • Maximum power dissipation rated at 500 milliwatts for thermal management.
  • Typical gate charge of 1.4 nano-Coulombs enabling fast switching.
  • Maximum gate-source voltage ±25 V allows robust drive conditions.

Product Description

onsemi FDN352AP is a PowerTrench Type P-Channel MOSFET optimized for surface mount applications requiring efficient power switching. Packaged in a 3-pin SOT-23 format, it supports a continuous drain current of 1.3 A and a maximum drain-source voltage of 30 V, making it suitable for compact electronic circuits and power management tasks.

This MOSFET features a low on-resistance of 180 milliohms, contributing to low conduction losses and higher overall system efficiency. The PowerTrench technology combines small gate charge and a soft reverse recovery diode, enhancing switching speed and reducing electromagnetic interference, which is essential in AC/DC power supply design and synchronous rectification.

Designed with an enhancement mode channel, the device guarantees high reliability over its temperature range from -55°C to 150°C. Its maximum power dissipation rating of 500 milliwatts facilitates thermal management in dense circuit layouts.

The FDN352AP can be deployed in a variety of industrial and electronic sectors including consumer electronics, industrial automation, and telecommunications where compact, efficient, and reliable MOSFETs are required. It supports robust operating conditions with a maximum gate-source voltage rating of ±25 V, ensuring stable drive from various control ICs.

PowerTrench technology ensures low gate charge and fast switching. Compact 3-pin SOT-23 package ideal for space-constrained designs. Low on-resistance for better conduction efficiency. Wide operating temperature range from -55°C to 150°C.

High power dissipation supports robust applications. Enhancement mode operation for efficient switching. Suitable for industrial, telecommunications, and consumer electronics.

Choose the onsemi FDN352AP PowerTrench P-Channel MOSFET for applications demanding high efficiency, reliability, and compactness. Explore more options in our Semiconductor MOSFET category for diverse power switching solutions on EnvMart.

onsemi PowerTrench Type P-Channel MOSFET Surface Mount 1.3 A 30 V 3-Pin SOT-23 FDN352AP
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Frequently Asked Questions

The maximum continuous drain current of the FDN352AP is 1.3 A.

This model has a maximum drain-source voltage of 30 V.

The maximum drain-source resistance for this MOSFET is 180 milliohms.

The operating temperature range for the FDN352AP is from -55°C to 150°C.

The typical gate charge for the FDN352AP is 1.4 nano-Coulombs.

This MOSFET is packaged in a 3-pin SOT-23 format.

The maximum power dissipation rated for the FDN352AP is 500 milliwatts.

The maximum gate-source voltage for the FDN352AP is ±25 V.

This model features an enhancement mode channel type.

The dimensions of the FDN352AP are 2.92 mm in length, 1.4 mm in width, and 940 μm in height.

This MOSFET can be deployed in consumer electronics, industrial automation, and telecommunications.

The FDN352AP is manufactured in India.

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