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Molex C-Grid III Series Straight Through Hole PCB Header, 8 Contact, 2 Row, 2.54 mm Pitch, Shrouded 90130-1108

Category PCB Headers Brand Molex Condition New

Specifications

Country of Origin Malaysia
Voltage 350V
Brand Molex
Orientation Straight
Current 3A
Mount Type Through Hole
Contact Material Brass
Series C-Grid III
Termination Type Solder
Maximum Operating Temperature 125°C
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 2.54mm
Contact Plating Tin
Number of Contacts 8
Contact Gender Male
Shrouded/Unshrouded Shrouded
Connector System Wire-to-Board
Tail Pin Length 2.9mm

Key Features

  • Complies with Molex C-Grid III series standards for reliable connectivity.
  • Features straight orientation with shrouded design for locking housings.
  • Contact material brass with tin plating ensures excellent conductivity and corrosion resistance.
  • Supports operating voltage up to 350 V and current rating of 3 A.
  • Suitable for wire-to-board connections with solder termination style.
  • Operates reliably in temperatures ranging from -55°C to 125°C.
  • Tail pin length of 2.9 mm optimized for secure soldering.
  • Designed for industrial and electronic equipment PCB applications requiring durable connector solutions.

Product Description

Molex 90130-1108 is a shrouded PCB header from the C-Grid III series, offering 8 male contacts arranged in 2 rows with a standard 2.54 mm pitch. This through-hole mount connector supports a maximum current of 3 A and voltage up to 350 V, making it suitable for various industrial, electronic, and manufacturing PCB interconnections requiring secure wiring solutions.

The straight orientation and shrouded locking header design enhance mechanical stability and prevent accidental disconnections. Contacts are crafted from brass with tin plating to ensure efficient electrical conductivity and corrosion protection.

This component operates reliably across a broad temperature range from -55°C up to 125°C, supporting demanding environmental conditions in electronics, control systems, automation, and industrial machinery applications.

Termination is via solder tail pins measuring 2.9 mm in length for robust PCB mounting. Ideal for wire-to-board applications in sectors such as manufacturing equipment, automation control, telecommunications, and instrumentation.

Complies with the established industry standard Molex C-Grid III series. Shrouded design secures connection with locking housings enhancing usage safety. Brass contact material with tin plating ensures durability and electrical integrity.

Designed for through-hole mount on PCBs with 2.54 mm pitch spacing. Rated for 3 A current and 350 V voltage, supporting various electronic loads. Wide operating temperature range from -55°C to 125°C for harsh environment tolerance.

Solder termination style suitable for standard PCB assembly processes. Compact, reliable connector solution for industrial electronic applications.

Originating from Malaysia, this Molex PCB header is new and ready to enhance your electronic designs. For more solutions, explore the Electronics & Electricals category at EnvMart.

Explore more products in our PCB Headers category.

Molex C-Grid III Series Straight Through Hole PCB Header, 8 Contact, 2 Row, 2.54 mm Pitch, Shrouded 90130-1108
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Frequently Asked Questions

The maximum operating voltage of this PCB header is 350 V.

This model has a current rating of 3 A.

The pitch size of the contacts is 2.54 mm.

It features 8 male contacts arranged in 2 rows.

The tail pin length is 2.9 mm, optimized for secure soldering.

This unit uses a solder termination style.

It operates reliably in temperatures ranging from -55°C to 125°C.

Yes, it is designed for through-hole mounting on PCBs.

The contacts are made from brass with tin plating for conductivity and corrosion resistance.

The design orientation is straight, with a shrouded locking header for enhanced stability.

It is suitable for wire-to-board connections in industrial, electronic, and manufacturing PCB applications.

This PCB header is manufactured in Malaysia.

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