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MBO Lead Free Solder Paste Sn96.5 Ag3 Cu0.5 Sirius 1 LF - Seringue Manu CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU |
Key Features
- This solder paste contains 96.5% tin, 3% silver, and 0.5% copper for robust electrical connections.
- It features high activity with chlorine-free composition for reliability.
- The product produces neutral and colourless minimal residue after reflow.
- Fine pitch capability down to 400 microns supports advanced electronic assembly.
- Suitable for industrial electronics manufacturing and repair applications.
- Manufactured in France and compliant with lead-free RoHS requirements.
Product Description
MBO CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU Lead Free Solder Paste is designed specifically for industrial and laboratory applications including electronics assembly, repair, and manufacturing.
This high-performance solder paste features a solder alloy composition of Sn96.5, Ag3, and Cu0.5, ensuring excellent electrical conductivity and mechanical strength.
It is formulated as a no-clean solder paste, which requires no post-reflow cleaning, contributing to efficiency in production environments. The paste is suitable for stencil printing and reflow soldering processes, providing reliable deposits for surface mount technology (SMT) assembly.
The solder paste supports fine pitch components down to 400 μm, making it ideal for detailed and miniaturized circuit board work. It is chlorine-free, thus reducing corrosion risk and environmental impact during use.
The product produces minimal, neutral, and colourless residue after soldering, enhancing the quality and aesthetics of the final assemblies. Manufactured in France, it adheres to lead-free regulations and standards required in modern electronics industry to ensure safe and eco-friendly processes.
This solder paste contains 96.5% tin, 3% silver, and 0.5% copper for robust electrical connections. It features high activity with chlorine-free composition for reliability. The product produces neutral and colourless minimal residue after reflow.
Fine pitch capability down to 400 microns supports advanced electronic assembly. Suitable for industrial electronics manufacturing and repair applications. Manufactured in France and compliant with lead-free RoHS requirements.
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Frequently Asked Questions
It contains 96.5% tin, 3% silver, and 0.5% copper, ensuring robust electrical connections.
This solder paste supports fine pitch components down to 400 microns, making it suitable for detailed circuit board work.
Yes, it is formulated as a no-clean solder paste, which eliminates the need for post-reflow cleaning.
It is manufactured in France, adhering to the standards required for modern electronics.
It is suitable for industrial electronics manufacturing and repair applications, particularly in electronics assembly.
It produces minimal, neutral, and colourless residue after soldering, enhancing the quality of the final assemblies.
Yes, it is compliant with lead-free RoHS requirements, ensuring safe and eco-friendly processes.
Key features include high activity, chlorine-free composition, and excellent electrical conductivity and mechanical strength.
It is suitable for stencil printing and reflow soldering processes, providing reliable deposits for surface mount technology (SMT) assembly.
The model name is CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU.
Its primary function is to ensure robust electrical connections in electronic assemblies, enhancing the performance of circuit boards.
The brand of this solder paste is MBO.
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