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MBO Lead Free Solder Paste in 100 g Syringes and Cartridges CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE AUTO
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE AUTO |
| Package Type | Syringes and Cartridges |
| Package Size | 100 g |
Key Features
- Contains 100 g of no-clean solder paste suitable for reflow processes.
- Composed of Sn96.5, Ag3, Cu0.5 for excellent soldering performance.
- Chlorine-free composition with neutral, colourless minimal residue.
- Fine pitch printing capability down to 400 μm.
- Designed for stencil printing and reflow soldering applications.
- High activity solder paste ensuring reliable joints.
- Manufactured in France ensuring quality standards.
Product Description
MBO CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE AUTO lead free solder paste is manufactured in France and supplied in 100 g syringes and cartridges. This solder paste is specifically designed for use in stencil printing for reflow soldering processes in electronics manufacturing.
The solder paste composition consists of 96.5% tin (Sn), 3% silver (Ag), and 0.5% copper (Cu), delivering excellent solder joint reliability and mechanical strength. The product is no-clean, leaving minimal neutral and colourless residues, and is chlorine-free to prevent corrosion and damage to sensitive electronics.
It features fine pitch capability down to 400 μm, making it suitable for high-density PCB assembly requiring precise solder paste deposition. The high activity of the solder paste ensures strong metallurgical bonds and consistency in soldering processes.
This product is widely used in industrial electronics, manufacturing, and assembly lines for reliable soldering applications requiring lead free and RoHS compliant materials. Contains 100 g of solder paste in syringes and cartridges.
Lead free solder paste with Sn96.5, Ag3, Cu0.5 alloy composition. Chlorine-free and no-clean formula with neutral, colourless minimal residue. Fine pitch stencil printing capability down to 400 μm. High activity solder paste for robust solder joints.
Manufactured in France to ensure quality and compliance.
This solder paste is ideal for industrial, electronics manufacturing, and laboratory applications requiring precise, reliable soldering. Explore more Solder Pastes and soldering tools in EnvMart’s Power Tools category for optimal soldering solutions.
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Frequently Asked Questions
The solder paste consists of 96.5% tin (Sn), 3% silver (Ag), and 0.5% copper (Cu).
It is supplied in syringes and cartridges, each containing 100 g of solder paste.
This model is chlorine-free, no-clean, and leaves minimal neutral and colorless residues. It also has fine pitch printing capability down to 400 μm.
It is manufactured in France, ensuring quality standards are met.
It is designed for stencil printing and reflow soldering applications in industrial electronics manufacturing and assembly lines.
It features high activity, ensuring strong metallurgical bonds and consistency in soldering processes.
It leaves minimal neutral and colorless residues, making it suitable for sensitive electronics.
It can achieve fine pitch printing capability down to 400 μm, suitable for high-density PCB assembly.
Yes, this solder paste is lead-free and complies with RoHS standards.
The package size is 100 g, available in syringes and cartridges.
It is specifically designed for reflow soldering processes in electronics manufacturing.
The no-clean formula means it does not require cleaning after soldering, which is beneficial for reducing processing time and costs.
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