CHIPQUIK Solder Paste No Clean 63Sn/37Pb 35 g Syringe SMD291AX10

CHIPQUIK SMD291AX10 solder paste is a no-clean 63Sn/37Pb alloy solder paste supplied in a 35 g syringe with plunger and tip, suitable for precise dispensing in laboratory, industrial electronics assembly, and manufacturing environments.

Its formulation supports printing speeds up to 100 mm/sec, offering a long stencil life and a wide process window that adapts to various soldering conditions. This solder paste produces clear residue and exhibits low voiding characteristics, which improves the overall aesthetic and reliability of soldered joints.

Designed to provide excellent wetting compatibility across most printed circuit board finishes, it ensures consistent solderability and strong mechanical bonds. The dispense grade is compatible with enclosed print heads, enhancing versatility in automated printing processes.

Conforming to standards J-STD-005A, J-STD-004B, J-STD-006C, and RoHS, it assures compliance with industrial safety and environmental regulations. Comes in a 35 g syringe with plunger and tip allowing easy dispensing. Compatible with printing speeds up to 100 mm/sec ensuring fast production.

Offers long stencil life to maximize usability during manufacturing. Features a wide process window for versatile application environments. Leaves clear residue, minimizing post-solder cleaning efforts. Exhibits low voiding to ensure high-quality solder joints.

Provides excellent wetting compatibility on most board finishes. Dispense grade solder paste compatible with enclosed print heads. Passes BONO test confirming reliability in industrial settings.

This solder paste is commonly used in industrial electronics manufacturing, laboratory prototyping, and precision soldering applications requiring high reliability and compliance with international standards.

Explore more Solder Paste and soldering supplies at EnvMart for comprehensive solutions catering to professional and industrial needs.