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MG Chemicals Solder Paste 4.21 ml Syringe 4860P-35G
Specifications
| Country of Origin | India |
|---|---|
| Brand | MG Chemicals |
| Model | 4860P-35G |
| Package Type | Syringe |
| Package Size | 4.21 ml |
Key Features
- The solder paste consists of high purity tin and lead alloy powder blended with a no-clean flux.
- It provides excellent tack force and superior wettability on PCB surfaces.
- Post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulating.
- The alloy complies with J-STD-006C and ASTM B 32 purity standards for reliable soldering quality.
- The flux conforms to J-STD-004B standards ensuring non-corrosive and halide-free properties.
- This solder paste is not lead-free.
- Packaged in a convenient 4.21 ml syringe for precise application.
- Ideal for industrial, laboratory, and electronics assembly environments.
Product Description
MG Chemicals 4860P-35G solder paste is supplied in a 4.21 ml syringe and is formulated for precision surface mount soldering applications. This high-quality solder paste combines a blend of high purity tin and lead alloy powder with a no-clean flux, ensuring strong adhesion and excellent flow characteristics during soldering processes.
The alloy exceeds the J-STD-006C standard and meets the ASTM B 32 purity requirements, guaranteeing superior solder joint integrity and consistent performance. The flux incorporated meets J-STD-004B criteria, providing a non-corrosive, halide-free, and non-conductive residue after soldering, which helps maintain the reliability and safety of electronic assemblies.
This solder paste is not lead-free, making it suitable for applications where leaded solder is permitted or preferred for mechanical strength or specific standards.
The transparent and highly insulated post-soldering residue facilitates easy inspection and prevents corrosion or electrical shorts, ensuring long-term stability of the soldered components.
The packaged 4.21 ml syringe format allows fine control over the solder paste dispensing, making it ideal for high-precision tasks in industrial manufacturing, electronics production, laboratory research, and repair work.
The solder paste contains high purity tin and lead alloy for reliable solder joints. Fully complies with J-STD-006C and ASTM B 32 to meet soldering quality standards. The no-clean flux meets J-STD-004B, ensuring non-corrosive and halide-free characteristics.
Residue is transparent, nonconductive, non-corrosive, and highly insulated after soldering. Not lead-free, suitable for leaded solder applications. Convenient 4.21 ml syringe packaging for precision application. Ideal for industrial, laboratory, and electronics assembly uses.
This product is a trusted choice for professionals requiring high performance solder paste that complies with industry standards for quality and safety. Explore related Solder Pastes and accessories for all your soldering needs on EnvMart.
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Frequently Asked Questions
The solder paste is packaged in a 4.21 ml syringe, allowing for precise application.
It consists of a high purity tin and lead alloy powder blended with a no-clean flux.
The alloy complies with J-STD-006C and ASTM B 32 purity standards, while the flux meets J-STD-004B standards.
No, this solder paste is not lead-free and is suitable for applications where leaded solder is permitted or preferred.
The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulating, which helps maintain the reliability of electronic assemblies.
It is ideal for industrial, laboratory, and electronics assembly environments, particularly for precision surface mount soldering applications.
The no-clean flux ensures that the residue left after soldering is non-corrosive and halide-free, which enhances the reliability and safety of electronic assemblies.
The solder paste is manufactured in India.
The model number of this solder paste is 4860P-35G.
It is packaged in a convenient syringe, which allows for fine control over the dispensing of the solder paste.
This solder paste provides excellent tack force and superior wettability on PCB surfaces during soldering processes.
The highly insulating properties of the post-soldering residue help prevent corrosion and electrical shorts, ensuring long-term stability of soldered components.
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