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CHIPQUIK Solder Paste 63Sn/37Pb No-Clean Water Washable 35 g Syringe SMD4300AX10
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMD4300AX10 |
| Package Type | Syringe |
| Package Size | 35 g |
| Standards/Approvals | RoHS, J-STD-006C, J-STD-004B, J-STD-005A |
Key Features
- Wide process window ensures compatibility with various PCB finishes.
- Offers long stencil life suitable for high-speed printing up to 100 mm/sec.
- Clear residue after soldering reduces cleaning requirements.
- Excellent wetting properties minimize voiding.
- Compatible with enclosed print heads for automated applications.
- Complies with RoHS, J-STD-006C, J-STD-004B, and J-STD-005A standards.
- Lead solder with 63% tin and 37% lead composition.
- Manufactured in Canada with stringent quality control.
Product Description
CHIPQUIK SMD4300AX10 solder paste is a high-performance 63Sn/37Pb no-clean solder paste designed for reliable electronic assembly processes. Packaged in a 35 g syringe equipped with a plunger and dispensing tip, it facilitates precise and controlled application suitable for laboratory, manufacturing, and industrial electronics production environments.
This solder paste delivers a wide process window and long stencil life, enabling printing speeds of up to 100 mm/sec while maintaining print quality and consistency. Its formula produces clear residues that reduce the need for extensive post-solder cleaning and exhibit excellent wetting, which minimizes voids and enhances solder joint reliability.
Engineered for compatibility with most PCB board finishes, the CHIPQUIK SMD4300AX10 is suitable for use with enclosed print heads in automated soldering processes. The solder paste complies fully with key industry standards including RoHS, J-STD-006C, J-STD-004B, and J-STD-005A, ensuring adherence to environmental and safety requirements.
The solder paste contains a 63% tin and 37% lead alloy composition, delivered in a convenient 35 g syringe package, manufactured to high quality standards in Canada. This product is ideal for professional assembly lines, electronics repair and rework, and HVAC control boards requiring precision soldering materials.
Wide process window ensures compatibility with various PCB finishes. Offers long stencil life suitable for high-speed printing up to 100 mm/sec. Clear residue after soldering reduces cleaning requirements. Excellent wetting properties minimize voiding.
Compatible with enclosed print heads for automated applications. Complies with RoHS, J-STD-006C, J-STD-004B, and J-STD-005A standards. Lead solder with 63% tin and 37% lead composition. Manufactured in Canada with stringent quality control.
Explore more Solder Paste and soldering materials in the Industrial Tools & Equipment catalog at EnvMart for reliable electronics manufacturing solutions.
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Frequently Asked Questions
This solder paste contains a 63% tin and 37% lead alloy composition, making it suitable for various electronic assembly applications.
It complies with RoHS, J-STD-006C, J-STD-004B, and J-STD-005A standards, ensuring it meets environmental and safety requirements.
The solder paste is packaged in a 35 g syringe, which includes a plunger and dispensing tip for precise application.
It offers long stencil life suitable for high-speed printing up to 100 mm/sec while maintaining print quality and consistency.
It is manufactured in Canada under stringent quality control standards, ensuring high performance and reliability.
It is ideal for professional assembly lines, electronics repair and rework, and HVAC control boards requiring precision soldering materials.
Yes, it produces clear residues that reduce the need for extensive post-solder cleaning, simplifying the process.
Yes, it is engineered for compatibility with enclosed print heads, making it suitable for automated applications.
It exhibits excellent wetting properties, which help minimize voiding and enhance solder joint reliability.
This model is a no-clean solder paste designed for reliable electronic assembly processes, ensuring ease of use and efficiency.
The dispensing tip allows for precise and controlled application of the solder paste, making it suitable for various electronic assembly tasks.
The wide process window ensures compatibility with various PCB finishes, allowing for flexibility in different assembly processes.
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