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CHIPQUIK Lead Free Solder Paste 35 g Syringe SMD4300SNL10
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMD4300SNL10 |
| Package Type | Syringe |
| Package Size | 35 g |
| Standards/Approvals | J-STD-004B, J-STD-006C, RoHS, J-STD-005A |
Key Features
- Solders with no-clean, lead-free formulation ensuring environmental compliance.
- Packaged in a convenient 10cc syringe for precise application.
- Printing speeds up to 100 mm/sec with long stencil life for efficient manufacturing.
- Compatible with enclosed print heads and passes BONO test at 1.56%.
- Features clear residue and low voiding for high reliability in PCB assembly.
- Wide process window and excellent wetting on most board finishes for consistent results.
- RoHS II and REACH compliant meeting global environmental standards.
- Water washable solder paste with plunger and tip included for ease of use.
Product Description
CHIPQUIK SMD4300SNL10 lead free solder paste in a 35 g syringe is designed for demanding soldering applications in industrial, electronics manufacturing, and assembly environments. This solder paste features a no-clean, lead-free formula that ensures compliance with modern environmental regulations including RoHS II and REACH.
Its packaging in a 10cc syringe with an included plunger and tip allows for precise dispensing and control during application, well-suited for printed circuit board (PCB) assembly and repair. The solder paste supports printing speeds up to 100 mm/sec, benefiting production efficiency while maintaining long stencil life and a wide process window. This flexibility ensures consistent printing and soldering quality across various substrates.
The paste produces clear residue with low voiding, contributing to the reliability and performance of the final soldered assembly. It is compatible with enclosed print heads and passes the BONO test at 1.56%, underscoring its quality and reliability for critical assembly processes.
Being water washable, the solder paste enhances cleaning options post-assembly, aiding in maintaining high product cleanliness standards. It exhibits excellent wetting compatibility on most board finishes commonly used in electronic assemblies.
Lead free no-clean solder paste for modern electronic assembly. 35 g syringe packaging offers convenient and precise application. Supports high-speed printing up to 100 mm/sec with long stencil life. Wide process window and low voiding ensure robust solder joints.
Compatible with enclosed print heads enhancing manufacturing versatility. Passes BONO test at 1.56% indicating high-quality performance. RoHS II and REACH compliant for environmental safety. Water washable with plunger and tip supplied for user convenience.
This solder paste is ideal for use in electronics manufacturing, laboratory prototyping, repair workshops, and industrial assembly lines requiring lead-free and environmentally safe soldering materials. CHIPQUIK products are trusted for quality and performance in the electronics industry.
Explore more in EnvMart's extensive range of Solder Pastes and related soldering tools for comprehensive assembly solutions.
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Frequently Asked Questions
The solder paste is packaged in a 35 g syringe, which allows for precise dispensing during application.
This model is compliant with RoHS II and REACH regulations, as well as J-STD-004B, J-STD-006C, and J-STD-005A standards.
It supports printing speeds of up to 100 mm/sec, which enhances production efficiency.
Yes, it produces clear residue with low voiding, contributing to the reliability of the soldered assembly.
It is suitable for electronics manufacturing, laboratory prototyping, repair workshops, and industrial assembly lines.
Yes, this solder paste is water washable, which aids in maintaining cleanliness post-assembly.
The package includes a plunger and tip for ease of use during application.
The solder paste is manufactured in Canada.
The model number is SMD4300SNL10, which identifies this specific solder paste formulation.
It passes the BONO test at 1.56%, indicating its quality and reliability for critical assembly processes.
It exhibits excellent wetting compatibility on most board finishes commonly used in electronic assemblies, ensuring consistent results.
It features a no-clean, lead-free formulation that ensures compliance with modern environmental regulations.
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