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Loctite Lead Free Solder Paste 600 g Container 1008020

Category Solder Paste Brand Loctite Condition New

Specifications

Country of Origin Hungary
Brand Loctite
Model 1008020
Package Type Container
Package Size 600 g

Key Features

  • This solder paste exhibits a high tack force to resist component movement during high speed placement.
  • It provides long print abandon time, including on small CSP apertures.
  • Colourless residues ensure easy post-reflow inspection.
  • Suitable for enclosed head printing processes.
  • Complies with international standards such as Telcordia GR-78-CORE, JIS-Z-3248, J-STD-006, ANSI/J-STD-004, and EN 29453.
  • Comes in a 600 g container package type for ease of use and storage.

Product Description

Loctite 1008020 Lead Free Solder Paste is designed for industrial and manufacturing applications requiring reliable soldering performance. This halide-free, no clean solder paste is lead-free, making it compliant with environmental regulations. It features excellent humidity resistance, which ensures consistent solder quality even in challenging conditions.

The product is formulated for a broad process window, allowing flexibility in both printing and reflow processes. Its high tack force secures components during high speed pick-and-place operations, reducing defects and improving assembly quality.

This solder paste offers long print abandon times, even with very small Chip Scale Package (CSP) apertures, supporting efficient high-volume production runs. Post-reflow residue is colorless and non-corrosive, facilitating straightforward inspection and maintenance.

Suitable for enclosed head printing, Loctite solder paste meets stringent standards including Telcordia GR-78-CORE, JIS-Z-3248, J-STD-006, ANSI/J-STD-004, and EN 29453, ensuring compatibility with various industrial quality requirements.

This solder paste exhibits a high tack force to resist component movement during high speed placement. It provides long print abandon time, including on small CSP apertures. Colourless residues ensure easy post-reflow inspection.

Suitable for enclosed head printing processes. Complies with international standards such as Telcordia GR-78-CORE, JIS-Z-3248, J-STD-006, ANSI/J-STD-004, and EN 29453. Comes in a 600 g container package type for ease of use and storage.

This solder paste is ideal for use in electronics manufacturing, laboratory prototyping, and repair environments where high-quality, reliable solder joints are essential. Its lead-free composition makes it suitable for environmentally conscious production processes. The 600 g container size supports repeat usage and controlled dispensing.

Explore the Loctite product range and Solder Pastes at EnvMart for additional soldering solutions suitable for industrial, laboratory, and electronic assembly applications.

Loctite Lead Free Solder Paste 600 g Container 1008020
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Frequently Asked Questions

The Loctite Lead Free Solder Paste comes in a 600 g container, which supports repeat usage and controlled dispensing.

This solder paste exhibits high tack force to resist component movement during high-speed placement, provides long print abandon times, and leaves colorless residues for easy post-reflow inspection.

Yes, it complies with several international standards, including Telcordia GR-78-CORE, JIS-Z-3248, J-STD-006, ANSI/J-STD-004, and EN 29453.

The solder paste is manufactured in Hungary.

It is ideal for use in electronics manufacturing, laboratory prototyping, and repair environments where reliable solder joints are essential.

This model is suitable for enclosed head printing processes.

It is a halide-free, no clean solder paste that is lead-free, making it compliant with environmental regulations.

Yes, it features excellent humidity resistance, ensuring consistent solder quality even in challenging conditions.

The model number of this solder paste is 1008020.

The high tack force helps secure components during high-speed pick-and-place operations, reducing defects and improving assembly quality.

The solder paste leaves colorless and non-corrosive residues, facilitating straightforward inspection and maintenance post-reflow.

It provides long print abandon times, even with very small Chip Scale Package (CSP) apertures, supporting efficient high-volume production runs.

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