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CHIPQUIK Lead Free Solder Paste 250 g Jar SMDLTLFP250T3

Category Solder Paste Brand CHIPQUIK Condition New

Specifications

Country of Origin Canada
Brand CHIPQUIK
Model SMDLTLFP250T3
Package Type Jar
Package Size 250 g
Standards/Approvals J-STD-006C, J-STD-005A, RoHS, J-STD-004B

Key Features

  • The solder paste contains Sn42/Bi57.6/Ag0.4 alloy optimized for low temperature applications.
  • It features a long stencil life and wide processing window to maintain consistent quality.
  • Clear residue and low voiding characteristics ensure reliable solder joints.
  • Excellent wetting compatibility on most board finishes for versatile use.
  • Print grade solder paste compatible with enclosed print heads for precision application.
  • Complies with J-STD-006C, J-STD-005A, RoHS, and J-STD-004B industry standards.
  • RoHS II and REACH compliant for environmental safety.
  • Manufactured in Canada with quality controls to ensure high reliability.

Product Description

The CHIPQUIK SMDLTLFP250T3 lead free solder paste in a 250 g jar is designed for industrial and commercial soldering applications requiring low temperature processes. This solder paste alloy with Sn42/Bi57.6/Ag0.4 melts at a low 138°C (281°F), allowing for faster printing speeds up to 100 mm/sec and a long stencil life. Its wide process window coupled with clear residue and low voiding offers exceptional solder joint quality.

It provides excellent wetting compatibility on most board finishes, making it suitable for use in electronics assembly, manufacturing, repair, and prototyping environments. The print grade formulation is compatible with enclosed print heads to facilitate precision solder paste deposition. The product meets multiple industry standards including J-STD-006C, J-STD-005A, RoHS, and J-STD-004B, ensuring compliance with established soldering quality and safety benchmarks.

This solder paste is RoHS II and REACH compliant, supporting environmental and health safety standards. Manufactured in Canada under stringent quality measures, it is an ideal choice for professional soldering operations in electronics manufacturing, laboratory use, and industrial assembly.

The solder paste contains Sn42/Bi57.6/Ag0.4 alloy optimized for low temperature applications. It features a long stencil life and wide processing window to maintain consistent quality. Clear residue and low voiding characteristics ensure reliable solder joints.

Excellent wetting compatibility on most board finishes for versatile use. Print grade solder paste compatible with enclosed print heads for precision application. Complies with J-STD-006C, J-STD-005A, RoHS, and J-STD-004B industry standards.

RoHS II and REACH compliant for environmental safety. Manufactured in Canada with quality controls to ensure high reliability.

Explore EnvMart for a comprehensive range of Solder Pastes and related soldering equipment by CHIPQUIK and other leading brands. Enhance your industrial or laboratory soldering operations with high-quality materials suitable for diverse applications.

CHIPQUIK Lead Free Solder Paste 250 g Jar SMDLTLFP250T3
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