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CHIPQUIK Lead Free Solder Paste, 35 g Syringe, J-STD-006C, J-STD-004B, RoHS Compliant SMDLTLFP10T5
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMDLTLFP10T5 |
| Package Type | Syringe |
| Package Size | 35 g |
| Standards/Approvals | J-STD-006C, J-STD-004B, RoHS, J-STD-005A |
Key Features
- This solder paste features Sn42/Bi57.6/Ag0.4 alloy with low-temperature melting characteristics.
- The syringe packaging facilitates precise dispensing for electronic assembly applications.
- Compatible with printing speeds up to 100 mm/sec, supporting efficient manufacturing throughput.
- It provides a long stencil life and a wide process window for reliability in production.
- The solder paste leaves clear residue with low voiding, ensuring high quality solder joints.
- Excellent wetting compatibility ensures adherence on most board finishes.
- Dispense grade formula is suitable for use with enclosed print heads.
- This product is RoHS II and REACH compliant, emphasizing environmental safety.
Product Description
CHIPQUIK SMDLTLFP10T5 Lead Free Solder Paste in a 35 g syringe is engineered for electronic soldering applications requiring low temperature and lead-free materials. The Sn42/Bi57.6/Ag0.4 alloy composition meets J-STD-006C, J-STD-004B, J-STD-005A standards and provides a safe alternative compliant with RoHS and REACH regulations. This solder paste is designed for high-speed printing, capable of speeds up to 100 mm/sec, making it ideal for modern SMT production lines.
The low temperature T5 mesh formula allows for a wide process window while maintaining a long stencil life which reduces downtime and increases yield. Clear residue after soldering minimizes additional cleaning steps and helps achieve low voiding solder joints critical in high reliability electronics. Its excellent wetting compatibility ensures robust solder connections on various board finishes including lead-free surface finishes.
Packaged in a convenient 35 g syringe, the solder paste enables precise dispensing, making it compatible with enclosed print heads to support consistent solder paste deposits. This dispense grade solder paste is particularly suited to industrial manufacturing, electronics assembly, and quality control processes.
Typical use cases include electronic manufacturing, laboratory prototyping, repair operations, and other industrial soldering applications requiring strict compliance with environmental regulations.
This solder paste features Sn42/Bi57.6/Ag0.4 alloy with low-temperature melting characteristics. The syringe packaging facilitates precise dispensing for electronic assembly applications. Compatible with printing speeds up to 100 mm/sec, supporting efficient manufacturing throughput.
It provides a long stencil life and a wide process window for reliability in production. The solder paste leaves clear residue with low voiding, ensuring high quality solder joints. Excellent wetting compatibility ensures adherence on most board finishes.
Dispense grade formula is suitable for use with enclosed print heads. This product is RoHS II and REACH compliant, emphasizing environmental safety. Explore more Solder Pastes and industrial power tools on EnvMart for your electronics manufacturing needs.
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Frequently Asked Questions
The solder paste features an alloy composition of Sn42/Bi57.6/Ag0.4, designed for low-temperature melting characteristics.
This product meets the standards J-STD-006C, J-STD-004B, and J-STD-005A, and is also RoHS compliant.
The solder paste is packaged in a 35 g syringe, allowing for precise dispensing.
It is compatible with printing speeds up to 100 mm/sec, supporting efficient manufacturing throughput.
This solder paste is suitable for electronic manufacturing, laboratory prototyping, repair operations, and other industrial soldering applications.
The solder paste leaves clear residue after soldering, which minimizes additional cleaning steps and helps achieve low voiding solder joints.
It provides excellent wetting compatibility, ensuring robust solder connections on various board finishes, including lead-free surface finishes.
The long stencil life reduces downtime during production and increases yield, making it beneficial for high-speed manufacturing processes.
Yes, it is RoHS II and REACH compliant, emphasizing its suitability for environmentally safe applications.
Yes, the dispense grade formula is suitable for use with enclosed print heads, supporting consistent solder paste deposits.
This product is manufactured in Canada.
The low temperature T5 mesh formula allows for a wide process window, contributing to its reliability in production.
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