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CHIPQUIK Solder Paste, 50 g Jar Sn63/Pb37 No Clean 90.25% Metal SMD291AX50T3

Category Solder Paste Brand CHIPQUIK Condition New

Specifications

Country of Origin Canada
Brand CHIPQUIK
Model SMD291AX50T3
Package Type Jar
Package Size 50 g
Standards/Approvals RoHS, J-STD-005A, J-STD-004B, J-STD-006C

Key Features

  • This solder paste features a long stencil life to support efficient printing operations.
  • Printing speeds can reach up to 100 mm per second for enhanced productivity.
  • It offers a wide process window, making it versatile for various soldering conditions.
  • Leaves a clear residue after soldering, ensuring clean electronic assembly.
  • Exhibits low voiding to improve solder joint quality and reliability.
  • Compatible with most board finishes, providing excellent wetting compatibility.
  • Print-grade formulation optimized for enclosed print heads.
  • Passes the BONO test, validating its quality and performance standards.

Product Description

CHIPQUIK SMD291AX50T3 solder paste in a 50 g jar is a high-quality, no-clean solder paste with a composition of Sn63/Pb37 containing 90.25% metal. This solder paste is engineered for use in industrial, electronics manufacturing, and repair applications that require reliable soldering. It supports printing speeds of up to 100 mm/sec, providing efficiency in surface mount device assembly processes. The product offers a long stencil life which ensures stability during extended printing sequences.

Its wide process window allows usage in a variety of soldering environments, maintaining excellent solder joint integrity. The solder paste leaves a clear residue that does not require cleaning, simplifying post-process steps and reducing operational costs. Additionally, the low voiding characteristic contributes to enhanced quality of solder joints and reduces potential failure points in electronic circuits.

Compatible with most board finishes, this print-grade solder paste works well with enclosed print heads, supporting precise application. The solder paste also complies with international standards including RoHS, J-STD-005A, J-STD-004B, and J-STD-006C, confirming its safe and effective use in leaded soldering applications. Originating from Canada, this product has passed the BONO test, ensuring compliance with quality and safety criteria typical in industrial soldering operations.

This solder paste features a long stencil life to support efficient printing operations. Printing speeds can reach up to 100 mm per second for enhanced productivity. It offers a wide process window, making it versatile for various soldering conditions.

Leaves a clear residue after soldering, ensuring clean electronic assembly. Exhibits low voiding to improve solder joint quality and reliability. Compatible with most board finishes, providing excellent wetting compatibility.

Print-grade formulation optimized for enclosed print heads. Passes the BONO test, validating its quality and performance standards.

This solder paste is ideal for industrial, electronics, laboratory, and manufacturing applications that require precise soldering and reliable surface mount technology assembly. Explore more products in the Solder Paste category on EnvMart to find compatible soldering materials and accessories.

CHIPQUIK Solder Paste, 50 g Jar Sn63/Pb37 No Clean 90.25% Metal SMD291AX50T3
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Frequently Asked Questions

This solder paste has a composition of Sn63/Pb37, containing 90.25% metal.

It supports printing speeds of up to 100 mm per second, enhancing productivity during surface mount device assembly.

This solder paste features a long stencil life, which supports efficient printing operations over extended sequences.

It leaves a clear residue after soldering, which does not require cleaning, simplifying post-process steps.

It exhibits low voiding characteristics, which improve solder joint quality and reliability.

Yes, it is compatible with most board finishes, providing excellent wetting compatibility.

It complies with several international standards including RoHS, J-STD-005A, J-STD-004B, and J-STD-006C.

This solder paste is packaged in a 50 g jar.

It is suitable for industrial, electronics, laboratory, and manufacturing applications that require precise soldering and reliable surface mount technology assembly.

The solder paste originates from Canada.

The model number of this solder paste is SMD291AX50T3.

It has a print-grade formulation optimized for enclosed print heads, supporting precise application.

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