Loctite Lead Free Solder Paste, Halogen-Free, No Clean, Low Voiding, 500 g Container 1817240

Loctite 1817240 Lead Free Solder Paste is a halogen-free, no clean, low voiding solder paste packed in a 500 g container. This solder paste is engineered to withstand the demanding thermal conditions of larger assemblies and offers a wide reflow process window, ensuring outstanding performance for high value printed circuit board (PCB) applications.

Specifically formulated for industry standard SAC alloys as well as high reliability SAC and low silver SAC alloys, it supports high-speed printing processes of up to 150 mm per second. Its compatibility with challenging surface finishes such as CuNiZn and Copper OSP enhances its versatility in various soldering environments.

The colorless residues left after reflow simplify inspection, improving manufacturing efficiency. Loctite 1817240 solder paste is designed for multiple application methods including printing, pin-in-paste, and enclosed head print capability, making it suitable for a broad range of soldering processes.

Its excellent wetting characteristics ensure reliable solder joints on a wide range of metallization surfaces, and it integrates seamlessly with existing halogen-free solutions to support environmentally responsible manufacturing practices.

This solder paste is particularly suitable for medium to large PCB assemblies commonly found in industrial, electronics manufacturing, and HVAC applications, where quality and reliability are paramount. Its halogen-free formulation aligns with increasingly stringent environmental regulations, and its robust physical properties provide excellent long-term performance for demanding industrial use cases.

Halogen-free and no clean solder paste for environmental compliance. Offers excellent thermal resistance suited for larger assemblies. Compatible with SAC, high reliability SAC, and low silver SAC alloys. Supports high speed printing up to 150 mm/s for efficient production.

Solderable on challenging surface finishes including CuNiZn and Copper OSP. Leaves colorless residues easing post-reflow inspection processes. Designed for printing, pin-in-paste, and enclosed head print capability. Exhibits excellent wetting to a broad range of metallization surfaces.

Compatible with existing halogen-free solutions for seamless integration. Ideal for medium to large PCB board assemblies. Explore our selection of Solder Pastes and related products at EnvMart for comprehensive solutions in soldering and assembly.