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MBO Lead Free Solder Wire 0.5 mm Diameter 217°C Melting Point 100g SN96.5 AG3 CU0.5 5/10 RT15 - 100G

Category Solder Wire Brand MBO Condition New

Specifications

Country of Origin France
Brand MBO
Model SN96.5 AG3 CU0.5 5/10 RT15 - 100G
Melting Point 217°C
Product Weight 100g
Wire Diameter 0.5mm
Product Form Wire
Percent Lead 0%
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin
Percent Copper 0.5%
MBO Wire, 0.5 mm Lead Free Solder, 217 °C Melting PointBrand MBO

Key Features

  • The solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper.
  • It features a rosin flux type, supporting no-clean soldering processes.
  • This wire is available in a 100g spool weight suitable for small to medium soldering tasks.
  • Designed with RT15 flux, it provides fast wetting, appropriate for surface mount device repairs.
  • Manufactured in France, ensuring high quality and consistency.
  • Contains 0% lead, complying with lead-free soldering standards and environmental regulations.

Product Description

MBO SN96.5 AG3 CU0.5 5/10 RT15 - 100G lead free solder wire is engineered to provide excellent soldering performance with a precise 0.5 mm diameter and a melting point of 217°C, making it highly suitable for electronic assembly and repair tasks requiring fine solder application.

This solder wire contains 96.5% tin, 3% silver, and 0.5% copper, delivering reliable mechanical strength and superior electrical conductivity. The integrated rosin flux facilitates clean solder joints without the need for additional cleaning, streamlining the manufacturing and repair process.

With a spool weight of 100 grams, this wire offers a manageable quantity for laboratory, industrial, and commercial soldering operations involving printed circuit boards (PCBs) and delicate electrical components.

The RT15 flux type is designed for fast wetting action, particularly effective in surface mount device (SMD) repairs, thus supporting efficient and precise rework and assembly in electronic manufacturing and repair facilities.

Manufactured in France, this product meets rigorous industrial standards ensuring excellent quality and reliability in demanding environments such as electronics manufacturing, laboratory prototyping, and maintenance.

The solder wire composition includes 96.5% tin ensuring strong bonds. Incorporates 3% silver for enhanced mechanical and electrical properties. Contains 0.5% copper to improve joint strength and corrosion resistance. Offers a no-clean rosin flux type that reduces residue and cleaning requirements.

Features a melting point of 217°C for effective soldering without overheating components. Lead-free with 0% lead content, compliant with environmental standards. Available in a 0.5 mm diameter wire for detailed soldering work.

Weight of the solder wire spool is 100 grams, suitable for laboratory or industrial use.

This Solder Wire is ideal for industrial, electronics manufacturing, laboratory, and repair applications where lead-free and high-performance soldering is required. Discover more soldering tools and equipment in the EnvMart catalogue for your professional needs.

MBO Lead Free Solder Wire 0.5 mm Diameter 217°C Melting Point 100g SN96.5 AG3 CU0.5 5/10 RT15 - 100G
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Frequently Asked Questions

The solder wire has a melting point of 217°C, making it suitable for various soldering tasks without overheating components.

This model features a diameter of 0.5 mm, which is ideal for detailed soldering work.

The solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, providing strong bonds and good electrical conductivity.

It uses a rosin flux type, which supports no-clean soldering processes and reduces residue after soldering.

The solder wire is available in a spool weighing 100 grams, suitable for small to medium soldering tasks.

This solder wire is manufactured in France, ensuring high quality and consistency.

Yes, this solder wire contains 0% lead, complying with lead-free soldering standards and environmental regulations.

The 3% silver enhances mechanical and electrical properties, while the 0.5% copper improves joint strength and corrosion resistance.

The product is in the form of wire, specifically designed for soldering applications.

For optimal performance, ensure that soldering equipment is compatible with the 0.5 mm diameter wire and the 217°C melting point.

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