MBO Lead Solder Wire 0.5 mm Diameter, 63% Tin 37% Lead, Rosin Flux, 183°C Melting SN63 PB 5/10 SANS NETTOYAGE RT15 - 500G

MBO SN63 PB 5/10 SANS NETTOYAGE RT15 - 500G Lead Solder Wire features a 0.5 mm diameter wire form composed of 63% tin and 37% lead, with a melting point of 183°C. It incorporates a rosin flux and is classified as a non-activated no-clean alloy, making it ideal for surface-mount device (SMD) repair and other precision soldering applications.

This solder wire exhibits excellent wetting properties on tin-plated substrates and generates minimal fumes and residue, enhancing work safety and cleanliness in industrial environments. It has zero chlorine content and includes a flux ratio of 1.5%, aligning with Class J-STD-004 ROL0 standards for quality assurance.

Manufactured in France, this product meets demanding industrial requirements for electronics manufacturing, repair, and assembly tasks. Its stable performance contributes to efficient workflow and durable solder joints in commercial and laboratory settings.

This solder wire uses a rosin flux type to ensure effective soldering and electrical conductivity. Non-activated no-clean solder alloy suitable for SMD repair applications. Provides excellent wetting on tin-plated substrates with minimal fumes and residues generated.

Chlorine content is 0%, flux ratio is maintained at 1.5% ensuring clean solder joints. Designed for industrial use in electronics manufacturing, repair, and assembly with consistent quality. Manufactured in France adhering to high-quality standards for reliable performance.

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