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MBO Lead Free Solder Wire 0.5 mm Diameter 100g Rosin Flux SN96.5 AG3 CU0.5 5/10 A11 - 100G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN96.5 AG3 CU0.5 5/10 A11 - 100G |
| Melting Point | 217°C |
| Product Weight | 100g |
| Wire Diameter | 0.5mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin |
| Percent Copper | 0.5% |
| Multicore Wire, 0.5 mm Lead Free Solder, 217 °C Melting PointBrand | Multicore |
Key Features
- Composed of 96.5% tin, 3% silver, and 0.5% copper for optimal conductivity.
- Features a rosin flux type ensuring clean and efficient solder joints.
- Product weight is 100 grams, suitable for detailed electronics soldering tasks.
- Designed as no-clean solder wire types RT15 and activated no-clean A11 for connector applications.
- Manufactured in France following strict quality standards without additional certifications.
- A11 spools optimize soldering connectors to various substrates reliably.
- RT15 spools with fast wetting speed support thorough SMD repair work.
- Lead free with 0% lead content to comply with environmental and safety regulations.
Product Description
MBO SN96.5 AG3 CU0.5 5/10 A11 - 100G lead free solder wire is a high-quality product designed for precision soldering in electronics and electrical applications.
It has a wire diameter of 0.5 mm and melts at 217 °C, enabling efficient soldering with reduced thermal damage. The alloy composition consists of 96.5% tin, 3% silver, and 0.5% copper, providing excellent conductivity and mechanical strength.
This solder wire includes a rosin flux type that ensures clean joints and reliable electrical connections. It is supplied in a 100-gram spool, suitable for both manual and automated soldering operations.
The product includes two variants: RT15 no-clean solder wire with fast wetting properties ideal for surface mount device repairs, and activated no-clean A11 solder wire designed for soldering connectors to various substrates.
Manufactured in France, this solder wire meets industry expectations for performance without specific standards or approvals cited. Composed of Sn96.5%, Ag3%, Cu0.5% alloy. 0% lead content ensures compliance with lead-free regulations.
0.5 mm wire diameter for precision soldering jobs. 217 °C melting point for controlled soldering temperature. Rosin flux type supporting clean joint formation. Available in 100 g spools for convenient handling. Suitable for industrial, electronics manufacturing, lab, and repair activities.
This MBO solder wire is ideal for industrial, electronics, manufacturing, and laboratory use cases requiring reliable, lead-free soldering solutions. Browse our categories for more professional-grade Soldering materials and accessories from MBO and other top brands at EnvMart.
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Frequently Asked Questions
The melting point of this solder wire is 217 °C, which allows for controlled soldering temperatures during use.
This solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, providing excellent conductivity and mechanical strength.
The wire diameter is 0.5 mm, making it suitable for precision soldering tasks.
It uses a rosin flux type, which ensures clean joints and reliable electrical connections during soldering.
The solder wire is supplied in a 100-gram spool, which is convenient for handling during soldering tasks.
This solder wire is manufactured in France, adhering to strict quality standards.
It is ideal for industrial, electronics manufacturing, laboratory, and repair activities requiring lead-free soldering solutions.
Yes, this solder wire contains 0% lead, ensuring compliance with lead-free regulations.
The product is in wire form, specifically designed for soldering applications.
The alloy composition of 96.5% tin, 3% silver, and 0.5% copper provides optimal conductivity and enhances the mechanical strength of the solder joints.
This solder wire is designed for detailed electronics soldering tasks, including manual and automated soldering operations.
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