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MBO Lead Solder Wire 1.5 mm Diameter, 183°C Melting Point, Rosin Flux, 500g SN60 PB CU2 15/10 - 3 CANAUX A11 - 500G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN60 PB CU2 15/10 - 3 CANAUX A11 - 500G |
| Melting Point | 183°C |
| Product Weight | 500g |
| Wire Diameter | 1.5mm |
| Product Form | Wire |
| Percent Lead | 38% |
| Percent Tin | 60% |
| Flux Type | Rosin |
| Chlorine content | 1.1 % |
| Percent Copper | 2% |
| MBO Wire, 1.2 mm Lead Solder, 183 °C Melting PointBrand | MBO |
| Multicore Wire, 1.6 mm Lead Solder, 183 °C Melting PointBrand | Multicore |
Key Features
- Composed of 38% lead, 60% tin, and 2% copper for reliable solder joints.
- Incorporates activated No-Clean resinous flux embedded in the core.
- Designed for electronics and connector manufacturing industries.
- Provides excellent wetting properties on tin-plated substrates.
- Generates minimal fumes and residues during soldering.
- Contains 1.1% chlorine content compliant with J-STD-004 ROM1 class standards.
- Product weight is 500 grams, suitable for industrial usage.
- Manufactured in France ensuring consistent quality and performance.
Product Description
MBO SN60 PB CU2 15/10 - 3 CANAUX A11 - 500G lead solder wire is a specialized activated no-clean solder alloy with resinous flux designed for industrial electronics soldering applications. Featuring a 1.5 mm wire diameter and melting point of 183°C, it is ideal for assembly processes requiring precise and durable solder joints.
The alloy composition consists of 38% lead, 60% tin, and 2% copper, delivering excellent wetting characteristics on tin-plated substrates and minimal flux residue. This solder wire incorporates a rosin flux core, enhancing soldering safety and quality while ensuring low fumes emission.
Measuring 500 grams per reel, this product is manufactured in France according to J-STD-004 ROM1 class standards with a chlorine content of 1.1%. It is widely used in the electronics and connector industries for demanding industrial environments where reliability and safety are paramount.
38% Lead, 60% Tin, and 2% Copper composition for solder strength and conductivity. Rosin-based activated no-clean flux minimizes cleaning requirements post-soldering. Certified to J-STD-004 ROM1 with controlled chlorine content for compliance.
Minimal fumes and residue generation enhance workplace safety. Optimized for tin-plated substrates ensuring strong and reliable bonds. Reel weight: 500g suitable for industrial soldering processes.
This solder wire is essential for industrial manufacturing, electronics assembly, connector production, and other commercial soldering applications requiring precision and durability. Shop MBO lead Solder wire at EnvMart for trusted quality and performance.
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Frequently Asked Questions
The melting point of this solder wire is 183°C.
The wire diameter is 1.5 mm.
The solder wire is composed of 38% lead, 60% tin, and 2% copper.
It incorporates rosin-based activated no-clean flux.
The chlorine content is 1.1%, compliant with J-STD-004 ROM1 class standards.
The product weight is 500 grams.
This solder wire is manufactured in France.
It is designed for the electronics and connector manufacturing industries.
It provides excellent wetting properties on tin-plated substrates and generates minimal fumes and residues during soldering.
Yes, it is suitable for industrial soldering processes due to its reliable performance and composition.
This solder wire is essential for electronics assembly, connector production, and other commercial soldering applications.
It complies with J-STD-004 ROM1 class standards for solder materials.
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