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MBO Lead Free Solder Wire 0.7 mm Diameter 217 °C Melting Point SN96.5 AG3 CU0.5 7/10 A11 - 100G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN96.5 AG3 CU0.5 7/10 A11 - 100G |
| Melting Point | 217°C |
| Product Weight | 100g |
| Wire Diameter | 0.7mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin |
| Percent Copper | 0.5% |
| MBO Wire, 0.7 mm Lead Free Solder, 217 °C Melting PointBrand | MBO |
| RS PRO Wire, 0.7mm Solder, 227°C Melting PointBrand | RS PRO |
Key Features
- The wire is composed of 96.5% tin, 3% silver, and 0.5% copper, ensuring high-quality solder joints.
- This rosin flux type solder wire is available in a 100 g spool, ideal for precise soldering tasks and repairs.
- Designed as a no-clean solder wire (RT15) and available in an activated no-clean variant (A11) for versatile usage.
- Suitable for soldering connectors to a variety of substrates with excellent wetting properties.
- Manufactured in France, meeting high standards for electronic and electrical applications.
- Eliminates lead content to comply with environmental and safety regulations.
Product Description
MBO SN96.5 AG3 CU0.5 7/10 A11 - 100G lead free solder wire features a 0.7 mm diameter and a melting point of 217 °C, suitable for industrial soldering, repair, and manufacturing processes.
This solder wire comprises 96.5% tin, 3% silver, and 0.5% copper, forming a robust alloy with excellent electrical and mechanical properties. The rosin flux (A11) enhances solder flow to produce clean, reliable joints without additional cleaning.
Available in a 100 g spool, this solder wire is designed primarily for soldering connectors across a wide range of substrates and is ideal for printed circuit board assembly and repairs, especially in the electronics and electrical manufacturing sectors.
The product includes both no-clean (RT15) and activated no-clean (A11) variants to accommodate different soldering requirements, with the A11 formulation optimized for connector soldering tasks.
Manufactured in France, the solder wire complies with modern environmental standards by being lead free, ensuring safety and sustainability in industrial, laboratory, electronics assembly, and HVAC applications.
The wire contains 0.7 mm diameter for precise soldering control and minimal material waste. Melting point of 217 °C supports efficient melting and joint formation. The alloy composition ensures durability, conductivity, and corrosion resistance.
Rosin flux enables no-clean soldering, reducing post-production cleaning needs. Suitable for professional use in industrial, electronics manufacturing, and repair operations. This Solder Wire is an essential tool in electronics assembly, industrial repair, and manufacturing operations, supporting high-quality and compliant solder joints.
Explore EnvMart's comprehensive range of soldering tools and materials for enhanced productivity and product quality.
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Frequently Asked Questions
The melting point of this solder wire is 217 °C, making it suitable for various soldering applications.
This solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, forming a robust alloy for soldering.
The diameter of this solder wire is 0.7 mm, allowing for precise soldering control.
It uses rosin flux, specifically designed for no-clean soldering, which reduces the need for post-soldering cleaning.
This solder wire is available in a spool weighing 100 g, suitable for various soldering tasks.
This solder wire is manufactured in France, meeting high standards for electronic and electrical applications.
This solder wire is lead-free, complying with environmental and safety regulations, making it a safer choice for industrial applications.
Yes, it is available in both no-clean (RT15) and activated no-clean (A11) variants to accommodate different soldering needs.
The alloy composition ensures excellent electrical and mechanical properties, enhancing the quality of solder joints.
Yes, it is designed for professional use in industrial, electronics manufacturing, and repair operations, supporting high-quality solder joints.
The rosin flux enhances solder flow, producing clean and reliable joints without the need for additional cleaning after soldering.
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