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RS PRO Lead Solder Wire 1.57 mm Diameter, 40% Lead, 60% Tin, Rosin Flux, 183°C Melting Point 179-6664
Specifications
| Country of Origin | United States |
|---|---|
| Brand | RS PRO |
| Model | 179-6664 |
| Melting Point | 183°C |
| Product Weight | 250g |
| Wire Diameter | 1.57mm |
| Product Form | Wire |
| Percent Lead | 40% |
| Percent Tin | 60% |
| Flux Type | Rosin |
Key Features
- Contains 40% lead and 60% tin for optimal soldering performance.
- Rosin flux type facilitates effective soldering without residue removal requirement.
- Melting point of 183°C ensures controlled solder melting.
- Wire form factor with a product weight of 250 grams.
- Manufactured in the United States for quality assurance.
- Residue can optionally be removed with Isopropanol or common PCB cleaning agents.
- Suitable for applications requiring fast spreading and reliable solder wetting action.
- Does not require activated rosin residues, preserving electronic reliability.
Product Description
RS PRO 179-6664 Lead Solder Wire is a 1.57 mm diameter wire formulated with 40% lead and 60% tin content. It features a rosin flux core designed for use in high reliability electronic assemblies where pure rosin cores do not provide sufficient spreading and solder wetting action. The solder has a melting point of 183°C, making it suitable for typical soldering processes in electronics manufacturing.
This solder wire weighs 250 grams and is manufactured in the United States, ensuring high quality and consistency. The rosin flux used does not require residue removal, though any residues present can be cleaned with Isopropanol or most PCB cleaning chemistries.
The product is especially useful in applications requiring clean solder joints without activated rosin residues that may compromise electronic reliability. It is ideal for soldering tasks demanding precise melting behavior and dependable flux performance.
Key features include excellent wetting properties, a consistent melting point, and a wire form factor facilitating easy handling and application in various soldering equipment setups.
This lead solder wire is commonly employed in industrial electronics manufacturing, laboratory assembly, and repair services, where solder integrity and reliability are critical. Applications span across sectors including industrial tools, power tools maintenance, electronics assembly, and HVAC control circuit fabrication.
Contains 40% lead and 60% tin ensuring optimal solder alloy characteristics. Rosin flux type provides non-activated, reliable fluxing action during soldering. Wire diameter of 1.57 mm allows for versatile use in precision soldering tasks.
Melting point rated at 183°C enables controlled and effective melting. Manufactured to high standards in the United States. Residue removal optional with Isopropanol or common PCB cleaning chemicals. Designed to improve wetting and spreading for reliable electronic joints.
Suited for use in industrial, laboratory, and electronics manufacturing environments. Explore a wide range of Solder Wires and related power tools in the Industrial Tools & Equipment category at EnvMart for your electronic assembly and maintenance needs.
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Frequently Asked Questions
The melting point of this solder wire is 183°C, allowing for controlled and effective melting during soldering processes.
This solder wire contains 40% lead and 60% tin, ensuring optimal solder alloy characteristics for effective soldering performance.
The solder wire has a diameter of 1.57 mm, making it suitable for precision soldering tasks.
It features a rosin flux core, which provides reliable fluxing action during soldering without requiring residue removal.
The product weight of this solder wire is 250 grams, facilitating easy handling and application.
This solder wire is manufactured in the United States, ensuring quality assurance and consistency.
It is commonly used in industrial electronics manufacturing, laboratory assembly, and repair services, where solder integrity is critical.
Yes, any residues from this solder wire can optionally be cleaned with Isopropanol or common PCB cleaning agents.
Yes, it is designed for use in high reliability electronic assemblies where sufficient spreading and solder wetting action is required.
This product is in wire form, which facilitates easy handling and application in various soldering equipment setups.
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