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RS PRO Lead Solder Wire 1.2 mm Diameter Rosin Flux 183 °C Melting Point 500g 179-6672
Specifications
| Country of Origin | United States |
|---|---|
| Brand | RS PRO |
| Model | 179-6672 |
| Melting Point | 183°C |
| Product Weight | 500g |
| Wire Diameter | 1.2mm |
| Product Form | Wire |
| Percent Lead | 40% |
| Percent Tin | 60% |
| Flux Type | Rosin |
| RS PRO Wire, 1.2 mm Lead Solder, 183 °C Melting PointBrand | RS PRO |
| Felder Lottechnik Wire, 1 mm Lead Solder, 179 °C Melting PointBrand | Felder Lottechnik |
Key Features
- Contains 40% lead and 60% tin for reliable solder joints.
- Has a melting point of 183 °C suitable for general soldering applications.
- Rosin flux type ensures non-corrosive and electronically non-conductive residues.
- Residues do not require removal but can be cleaned with Isopropanol or PCB cleaning chemistries.
- Product form is wire, weighing 500 grams for versatile use.
Product Description
RS PRO 179-6672 Lead Solder Wire is a 1.2 mm diameter wire designed for general soldering tasks with a melting point of 183 °C. Manufactured in the United States, this rosin-based solder provides rapid solder wetting action combined with excellent flowing properties, ensuring high-quality solder joints necessary for electronics manufacturing, repair, and assembly.
The alloy consists of 40% lead and 60% tin, delivering the ideal balance for strength and melting characteristics. Its rosin flux formulation produces non-corrosive and electronically non-conductive residues, enhancing the longevity and reliability of soldered connections.
The residues from soldering do not require removal; however, if necessary, they can be cleaned easily using Isopropanol or most PCB cleaning chemistries, facilitating maintenance without damaging sensitive electronic components.
Ideal for use in industrial, laboratory, manufacturing, and electronics assembly environments, this Solder Wire supports diverse applications requiring precision and consistent soldering results.
Weighing 500 grams, this spool provides a practical quantity for regular soldering tasks, offering convenience and efficiency. Contains 40% lead and 60% tin for reliable solder joints. Has a melting point of 183 °C suitable for general soldering applications.
Rosin flux type ensures non-corrosive and electronically non-conductive residues. Residues do not require removal but can be cleaned with Isopropanol or PCB cleaning chemistries. Product form is wire, weighing 500 grams for versatile use.
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Frequently Asked Questions
The melting point of this solder wire is 183 °C, making it suitable for general soldering applications.
This solder wire has a diameter of 1.2 mm, which is standard for various soldering tasks.
The solder wire consists of 40% lead and 60% tin, providing a reliable balance for solder joints.
It uses a rosin flux type, which ensures that the residues are non-corrosive and electronically non-conductive.
This solder wire weighs 500 grams, offering a practical quantity for regular soldering tasks.
The residues do not require removal, but if needed, they can be cleaned with Isopropanol or PCB cleaning chemistries.
This solder wire is manufactured in the United States.
This solder wire is ideal for use in industrial, laboratory, manufacturing, and electronics assembly environments.
The solder joints produced with this wire are reliable due to its composition and melting characteristics, ensuring quality in electronics manufacturing and repair.
No specific maintenance is required for the solder wire itself, but residues can be cleaned if necessary using appropriate cleaning agents.
No specific setup is required; it can be used directly for general soldering tasks as per standard soldering practices.
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