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MBO Lead Free Solder Wire 0.7 mm Diameter 217 °C Melting Point 500 g SN96.5 AG3 CU0.5 7/10 RT15 - 500G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN96.5 AG3 CU0.5 7/10 RT15 - 500G |
| Melting Point | 217°C |
| Product Weight | 500g |
| Wire Diameter | 0.7mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin |
| Percent Copper | 0.5% |
| MBO Wire, 0.7 mm Lead Free Solder, 217 °C Melting PointBrand | MBO |
Key Features
- The wire is composed of 96.5% tin, 3% silver, and 0.5% copper to provide optimal soldering performance.
- This rosin flux core solder wire contains no lead, ensuring environmentally friendly use.
- It offers fast wetting properties, ideal for surface mount device (SMD) repairs and electronics soldering.
- Available in a 500 gram spool, suitable for laboratory and industrial uses.
- Manufactured in France, adhering to high-quality standards for reliability and consistency.
Product Description
MBO SN96.5 AG3 CU0.5 7/10 RT15 - 500G lead free solder wire is a high-quality soldering material designed for precision applications in electronics manufacturing, repair, and laboratory usage. It features a 0.7 mm diameter wire that melts at 217 °C, facilitating efficient solder joints with excellent wetting capability.
The solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper, optimized to provide strong mechanical and electrical connections without the use of lead, making it compliant with RoHS regulations and environmentally responsible manufacturing processes.
The built-in rosin flux core ensures reliable soldering by improving solder flow and adhesion, reducing the need for additional flux application. This solder wire is particularly well-suited for soldering connectors on all substrates and surface mount device repairs.
Each spool contains 500 grams of solder wire, providing sufficient material for medium to large-scale electronics manufacturing or repair tasks. Made in France, this product exemplifies high manufacturing standards essential for industrial, laboratory, and commercial use cases.
The wire diameter of 0.7 mm allows precise soldering work suitable for fine electronic components. The flux type is rosin, contributing to cleaner solder joints with minimal residue. Lead free composition promotes safer handling and reduced environmental impact.
The melting point of 217 °C efficiently balances melting performance and component protection. Solder weight of 500 g makes it a convenient size for repeated soldering tasks.
Suitable for industrial, laboratory, and electronics manufacturing sectors, this Solder Wire ensures high-performance solder joints that meet contemporary quality and safety demands.
Explore the wider range of soldering and welding products at EnvMart for complementary tools and materials designed to meet the highest industry standards.
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Frequently Asked Questions
The melting point of this solder wire is 217 °C, which facilitates efficient solder joints while protecting components.
The solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper, providing optimal soldering performance without lead.
This solder wire has a diameter of 0.7 mm, making it suitable for precise soldering work on fine electronic components.
The solder wire features a rosin flux core, which improves solder flow and adhesion, minimizing the need for additional flux.
Each spool contains 500 grams of solder wire, providing ample material for medium to large-scale electronics manufacturing or repair tasks.
This solder wire is manufactured in France, adhering to high-quality standards for reliability and consistency.
Yes, this solder wire is lead-free, making it compliant with RoHS regulations and environmentally responsible for use in electronics.
Key features include a 0.7 mm diameter, 217 °C melting point, rosin flux core, and a composition of 96.5% tin, 3% silver, and 0.5% copper.
The 217 °C melting point efficiently balances melting performance and component protection during soldering tasks.
Yes, this solder wire is suitable for industrial, laboratory, and commercial use cases, ensuring high-performance solder joints.
The rosin flux in this solder wire enhances solder flow and adhesion, resulting in cleaner solder joints with minimal residue.
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