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CHIPQUIK Lead Free Solder Paste, 15 g Syringe SMDLTLFP
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMDLTLFP |
| Package Type | Syringe |
| Package Size | 15 g |
| Standards/Approvals | RoHS, J-STD-006C, J-STD-004B, J-STD-005A |
| MG Chemicals Lead Free Solder Paste, 15 g SyringeBrand | MG Chemicals |
| CHIPQUIK Lead Free Solder Paste, 15 g SyringeBrand | CHIPQUIK |
Key Features
- This lead-free solder paste features a Sn42/Bi57.6/Ag0.4 composition with a eutectic melting point of 138°C (281°F).
- It supports printing speeds up to 100 mm/sec while providing long stencil life for efficient operation.
- The paste offers a wide process window ensuring consistent performance on most board finishes.
- Residue after soldering is clear and low voiding characteristics improve joint quality.
- It demonstrates excellent wetting compatibility across various electronic substrates.
- Dispense-grade paste compatible with enclosed print heads enhances application precision.
- Fully RoHS II and REACH compliant, ensuring environmental and safety standards are met.
- Manufactured in Canada under certifications including J-STD-006C, J-STD-004B, and J-STD-005A.
Product Description
CHIPQUIK SMDLTLFP Lead Free Solder Paste, supplied in a 15 g syringe package, offers reliable soldering performance for electronic assembly and repair.
The solder paste consists of a low temperature melting Sn42/Bi57.6/Ag0.4 alloy with a eutectic melting point of 138°C (281°F), which ensures efficient reflow soldering while maintaining sensitive component safety.
Its formulation supports printing speeds up to 100 mm per second with an extended stencil life, allowing for high throughput in manufacturing processes. The wide process window facilitates stable solder joints across varied operating conditions.
Post-soldering, the clear residue and minimal voiding contribute to enhanced circuit reliability, while the paste's excellent wetting on diverse board finishes ensures uniform joints. Its dispense grade quality is compatible with enclosed print heads for precision dispensing during assembly.
The product complies with RoHS II and REACH regulations, meeting strict environmental and health safety requirements for industrial and laboratory applications.
Manufactured in Canada, CHIPQUIK SMDLTLFP solder paste is certified under J-STD-006C, J-STD-004B, and J-STD-005A standards, confirming its quality and reliability in professional soldering environments.
This lead-free solder paste features a Sn42/Bi57.6/Ag0.4 composition with a eutectic melting point of 138°C (281°F). Supports printing speeds up to 100 mm/sec and provides long stencil life. Wide process window ensures consistent solder performance.
Clear residue after soldering with low voiding to enhance joint quality. Excellent wetting compatibility on various board finishes. Dispense-grade compatible with enclosed print heads. Compliant with RoHS II and REACH standards.
Manufactured in Canada under J-STD certifications.
This Solder Paste is ideal for industrial electronics manufacturing, rework stations, laboratory prototyping, and quality assurance environments requiring precise and reliable soldering materials. Explore EnvMart's selection for compatible soldering tools and maintenance accessories.
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Frequently Asked Questions
This solder paste features a Sn42/Bi57.6/Ag0.4 composition, providing a eutectic melting point of 138°C (281°F).
It supports printing speeds up to 100 mm/sec, allowing for efficient manufacturing processes.
The residue after soldering is clear, and it has low voiding characteristics which enhance joint quality.
Yes, it is fully RoHS II and REACH compliant, ensuring it meets strict environmental and safety standards.
It is certified under J-STD-006C, J-STD-004B, and J-STD-005A standards, confirming its quality for professional use.
The solder paste is supplied in a 15 g syringe package.
It is ideal for industrial electronics manufacturing, rework stations, laboratory prototyping, and quality assurance environments.
It demonstrates excellent wetting compatibility across various electronic substrates, ensuring uniform solder joints.
This solder paste is manufactured in Canada.
It is dispense-grade and compatible with enclosed print heads, enhancing application precision during assembly.
The solder paste provides a long stencil life, which contributes to efficient operation in manufacturing processes.
Key features include a eutectic melting point of 138°C, support for high printing speeds, clear residue, and compliance with environmental standards.
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