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Multicore Leaded Solder Paste Tub 500 g with Low Wastage Qualities 653555
Specifications
| Country of Origin | India |
|---|---|
| Brand | Multicore |
| Particle size | 15-45 µm |
| Model | 653555 |
| Package Type | Tub |
| Package Size | 500 g |
| Residue | Colourless |
| Multicore Lead Free Solder Paste, 500 g TubBrand | Multicore |
| Ultra fine pitch NC62 solder paste,500gBrand | Multicore |
Key Features
- This solder paste is halide free with flux classification ROL0 conforming to ANSI/J-STD-004 standards.
- It leaves a colourless residue for clear and easy post reflow inspection.
- Designed for fine pitch, high-speed printing up to 150 mm/s with particle size between 15 and 45 µm.
- Offers extended open time and tack life for reduced waste during soldering processes.
- Supplied in convenient 500 g tubs suitable for industrial and laboratory use.
- Recommended storage is in a cool place such as a refrigerator to preserve product quality.
- Ideal for soldering and welding applications in electronics manufacturing and repair.
Product Description
Multicore 653555 solder paste is a leaded solder paste supplied in a 500 g tub, engineered for precise and efficient soldering in electronics manufacturing, laboratory, and industrial applications.
This product offers no-clean solder paste qualities with low wastage, ensuring efficient use and excellent humidity resistance to maintain solder joint reliability under challenging environmental conditions.
The halide-free flux complies with flux classification ROL0 as per ANSI/J-STD-004 standards, producing a colourless residue that facilitates easy post reflow inspection and quality control.
Its extended open time and tack life allow operators to perform high-speed printing up to 150 mm/s with fine pitch components, supported by an optimal particle size distribution of 15 - 45 µm.
The solder paste is supplied in 500 g tubs, enabling convenient handling and storage. It is recommended to store the product in a cool environment, preferably a refrigerator, to maintain paste consistency and performance.
Applications include industrial electronics assembly, power tools soldering, repair workshops, and construction of precision electronic devices requiring high reliability. This solder paste is halide free with flux classification ROL0 conforming to ANSI/J-STD-004 standards.
It leaves a colourless residue for clear and easy post reflow inspection. Designed for fine pitch, high-speed printing up to 150 mm/s with particle size between 15 and 45 µm. Offers extended open time and tack life for reduced waste during soldering processes.
Supplied in convenient 500 g tubs suitable for industrial and laboratory use. Recommended storage is in a cool place such as a refrigerator to preserve product quality. Ideal for soldering and welding applications in electronics manufacturing and repair.
Explore our Electronics Components category to find more Multicore soldering solutions and related Solder Paste products at EnvMart.
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Frequently Asked Questions
The particle size range of this solder paste is between 15 and 45 µm.
It is supplied in a 500 g tub, making it convenient for handling and storage.
The flux is halide-free and classified as ROL0, conforming to ANSI/J-STD-004 standards, which produces a colourless residue for easy post reflow inspection.
It is ideal for soldering and welding applications in electronics manufacturing, repair workshops, and the construction of precision electronic devices.
It is recommended to store the product in a cool place, preferably in a refrigerator, to preserve its quality.
This solder paste is designed for high-speed printing up to 150 mm/s, suitable for fine pitch components.
It leaves a colourless residue, which facilitates clear and easy post reflow inspection.
The country of origin for this product is India.
It offers extended open time and tack life, which helps in reducing waste during soldering processes.
The model number of this solder paste is 653555.
This model is classified as a no-clean solder paste, which means it does not require cleaning after soldering.
It is primarily used for precise and efficient soldering in electronics manufacturing and laboratory applications.
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