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Loctite Lead Free Solder Paste Container 500 g, Halogen-Free, Low Void, No-Clean Flux 2002845
Specifications
| Country of Origin | Hungary |
|---|---|
| Brand | Loctite |
| Model | 2002845 |
| Package Type | Container |
| Package Size | 500 g |
| Standards/Approvals | J-STD 006, J-STD-005A, ANSI/J-STD-004 Rev. B |
Key Features
- Halogen-free flux ensures better environmental compliance.
- Formulated for long term stability across a wide temperature range.
- Suitable for high-speed printing up to 125 mm/s.
- Residues are print testable after four reflow cycles.
- Low voiding characteristics improve solder joint reliability.
- Complies with industry standards J-STD 006, J-STD-005A, ANSI/J-STD-004 Rev. B.
Product Description
Loctite 2002845 Lead Free Solder Paste is supplied in a 500 g container and is specially formulated as a halogen-free, zero halogens added, no-clean solder paste with low voiding properties and Pb-free composition.
Its novel formulation enhances paste stability, allowing excellent performance and long-term storage stability over varied temperature conditions, which benefits both yield and paste utilization in industrial soldering processes.
This solder paste is suitable for high-speed stencil printing applications up to 125 mm/s, making it ideal for modern manufacturing lines requiring rapid throughput with consistent paste deposition quality.
The residue after soldering remains testable even after four reflow cycles, supporting quality control and inspection requirements in electronics assembly. Certified to meet standards J-STD 006, J-STD-005A, and ANSI/J-STD-004 Rev. B, it assures compliance with soldering industry quality and reliability benchmarks.
Originating from Hungary, this product is commonly used in electronics manufacturing, repair, and prototyping applications, including industrial, laboratory, and commercial soldering tasks.
Halogen-free flux for environmentally responsible soldering. Enhanced paste stability over temperature variations. Compatible with high-speed printing processes. Print testable residues after multiple reflows. Low voiding for reliable solder joints.
Meets multiple industry soldering standards. Explore the extensive range of Loctite Solder Pastes for reliable soldering solutions available at EnvMart.
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Frequently Asked Questions
The Loctite Lead Free Solder Paste is supplied in a container that weighs 500 g.
This solder paste complies with industry standards J-STD 006, J-STD-005A, and ANSI/J-STD-004 Rev. B.
The solder paste originates from Hungary.
It uses halogen-free flux, ensuring better environmental compliance and low voiding properties.
This model is suitable for high-speed stencil printing applications up to 125 mm/s.
The residues from this solder paste remain print testable even after four reflow cycles, supporting quality control.
It is commonly used in electronics manufacturing, repair, and prototyping applications, including industrial, laboratory, and commercial soldering tasks.
The solder paste features low voiding characteristics, which improve solder joint reliability.
The solder paste is packaged in a container.
Yes, its formulation enhances paste stability, allowing for long-term storage over varied temperature conditions.
It is formulated as a halogen-free, no-clean solder paste with a Pb-free composition.
The model number for this solder paste is 2002845.
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