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CHIPQUIK Lead Free Solder Paste, 50 g Jar SMDLTLFP50T3

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CHIPQUIK Lead Free Solder Paste, 50 g Jar SMDLTLFP50T3

Name: CHIPQUIK Lead Free Solder Paste, 50 g Jar SMDLTLFP50T3
Brand: CHIPQUIK
SKU: 147348
Price: 33.48 USD
Availability: InStock

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Category Solder Paste Brand CHIPQUIK Condition New

Specifications

Country of Origin	Canada
Brand	CHIPQUIK
Model	SMDLTLFP50T3
Package Type	Jar
Package Size	50 g
Standards/Approvals	J-STD-004B, J-STD-005A, RoHS, J-STD-006C

Key Features

This solder paste melts at a low temperature of 138°C (281°F) to enhance process efficiency.
Contains 90% metal with a Sn42/Bi57.6/Ag0.4 composition, optimizing solder quality.
Offers printing speeds up to 100mm/sec and is print grade compatible with enclosed print heads.
Features long stencil life and a wide process window for reliable manufacturing.
Produces low voiding and clear residue, ideal for fine pitch assembly on most board finishes.
Meets industry standards including J-STD-004B, J-STD-005A, J-STD-006C, RoHS II, and REACH compliance.
Packaged in a convenient jar to facilitate controlled dispensing during assembly.
Manufactured in Canada ensuring quality and consistency with hazardous product identification.

Product Description

CHIPQUIK SMDLTLFP50T3 Lead Free Solder Paste is a premium 50 g jar product engineered for advanced soldering applications in electronics manufacturing. It features a low melting point of 138°C (281°F) with a Sn42/Bi57.6/Ag0.4 alloy providing 90% metal content, ensuring superior melt flow and wetting properties for a wide range of printed circuit boards and components. This solder paste allows printing speeds up to 100mm/sec, supporting efficient high-volume production. Its long stencil life and wide process window enable manufacturers to maintain consistent quality with reduced downtime.

Designed to leave clear residue and low voiding, the solder paste supports high reliability in complex assemblies including fine pitch components. It is compatible with enclosed print heads and print grade to meet modern surface mount technology requirements. Certified to meet J-STD-004B, J-STD-005A, J-STD-006C standards as well as RoHS II and REACH regulations, it ensures environmental and safety compliance.

Manufactured in Canada, this product is identified as hazardous and should be handled accordingly. It is suitable for industrial, laboratory, electronics assembly, manufacturing, and repair operations requiring consistent solder paste performance. The packaging provides easy handling and dispensing to optimize usage and reduce waste.

This solder paste has a low melting temperature of 138°C for energy-efficient soldering. Sn42/Bi57.6/Ag0.4 composition provides 90% metal content for excellent solder joints. Compatible with high-speed printing up to 100mm/sec and long stencil life.

Leaves clear residue with low voiding for reliable electronic connections. Conforms to key industry standards for quality and environmental safety. Packaged in a 50 g jar for convenient, precise application. Manufactured in Canada, meeting strict quality controls.

Ideal for electronics manufacturing, assembly, and repair applications. Explore more in the Solder Paste category at EnvMart for reliable electronics assembly solutions.