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MBO Lead Free Solder Paste Sn96.5 Ag3 Cu0.5 Rosin Flux 217°C Melting Point CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - POT DE 500G

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MBO Lead Free Solder Paste Sn96.5 Ag3 Cu0.5 Rosin Flux 217°C Melting Point CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - POT DE 500G

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Category Solder Paste Brand MBO Condition New

Specifications

Country of Origin	France
Brand	MBO
Model	CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - POT DE 500G
Melting Point	217°C
Product Weight	500g
Product Form	Paste
Percent Lead	0%
Percent Silver	3%
Percent Tin	96.5%
Flux Type	Rosin
Percent Copper	0.5%
Multicore Lead Free Solder Paste, 500 g TubBrand	Multicore

Key Features

The solder paste is no-lead, containing 0% lead to comply with environmental standards.
It contains 96.5% tin, 3% silver, and 0.5% copper, ensuring high-quality solder joints.
The flux type used is rosin, providing excellent activity and minimal residues.
This is a no-clean solder paste suitable for stencil printing and reflow processes.
The product offers fine pitch capability down to 400 micrometers for precise applications.
Residues are minimal, neutral, and colorless, reducing post-process cleaning.
The solder paste is chlorine-free, enhancing safety and compliance.
It is supplied in a 500 gram pot, suitable for industrial and laboratory soldering needs.

Product Description

MBO CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - POT DE 500G lead free solder paste is a high-quality solder paste designed for professional soldering applications, featuring a melting point of 217°C. It is specially formulated without lead, conforming to modern environmental and safety requirements, making it ideal for electronics manufacturing and repair.

This solder paste consists of 96.5% tin, 3% silver, and 0.5% copper, providing excellent mechanical strength and electrical conductivity in soldered joints. The rosin flux type used in formulation offers high activity with minimal residue, ensuring reliable soldering results and reducing the need for post-soldering cleaning.

The no-clean characteristics of this paste are suitable for stencil printing and reflow soldering processes, supporting efficient production in industrial and laboratory settings. Its fine pitch capability down to 400 micrometers enables high-precision soldering necessary for modern electronic components.

The solder paste leaves minimal, neutral, and colorless residues, which are chlorine-free, further enhancing user safety and compliance with rigorous manufacturing standards. This product is packaged in a 500-gram pot, providing ample material for continuous usage.

Applications include electronics assembly, manufacturing, laboratory prototyping, and repair work involving sensitive electronic circuits and components. It supports industrial and laboratory environments requiring reliable and environmentally compliant soldering materials.

The solder paste is no-lead and environmentally compliant. Contains 96.5% tin, 3% silver, 0.5% copper for superior solder joints. Rosin flux provides high activity and minimal residues. Suitable for stencil printing and reflow soldering processes.

Fine pitch capability down to 400 micrometers for precision soldering. Residues are minimal, neutral, colorless, and chlorine-free. Packaged in a 500 gram pot for industrial use.

This product is a reliable choice for professional soldering in industrial, laboratory, and manufacturing environments. Explore more products in our Electronics Components Solder Paste category at EnvMart to find complementary materials and accessories.