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MBO Leaded No-Clean Solder Paste Sn62 Pb Ag2, Fine Pitch 400 μm, Manual CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE MANU 30G

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MBO Leaded No-Clean Solder Paste Sn62 Pb Ag2, Fine Pitch 400 μm, Manual CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE MANU 30G

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Category Solder Paste Brand MBO Condition New

Specifications

Country of Origin	France
Brand	MBO
Model	CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE MANU 30G
MBO Paste Lead Solder, 179 °C Melting PointBrand	MBO
Circuitworks CW8500 3.5 g Lead Free Solder Flux SyringeBrand	Circuitworks

Key Features

Leaded solder paste with Sn62 Pb Ag2 composition for reliable solder joints.
No-clean formulation resulting in minimal, neutral, and colourless residues.
Chlorine-free, minimizing corrosive effects on circuit boards.
Fine pitch capability suitable for high density component assembly to 400 μm.
High activity paste ensuring excellent wetting and solder flow during reflow.
Supplied in a 30g manual syringe format for precise application.
Compliant with standards NFC90550, J-STD-006, and EN 29453 for quality assurance.
Manufactured in France ensuring consistent European quality standards.

Product Description

MBO CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE MANU 30G solder paste is a high-performance leaded solder paste designed for industrial electronics manufacturing and repair applications. It features a Sn62 Pb Ag2 alloy composition and is supplied in a 30-gram manual syringe suitable for precise stencil printing and controlled application in reflow soldering processes.

This no-clean type solder paste produces minimal residue that is neutral and colourless, facilitating better aesthetics and reliability in electronics solder joints without the need for post-solder cleaning. Its chlorine-free formulation reduces the risk of corrosion and damage to sensitive components and circuit boards.

The solder paste supports fine pitch capability down to 400 microns, accommodating high density component layouts and advanced PCB assembly requirements. Its high chemical activity ensures excellent wetting properties and solder flow, promoting strong mechanical and electrical bond formation during reflow cycles.

This product complies with industry standards including NFC90550, J-STD-006, and EN 29453, ensuring robust performance and quality consistency for industrial, laboratory, and commercial soldering applications.

Manufactured in France, this solder paste is ideal for electronics assembly shops, industrial manufacturing plants, repair workshops, and R&D laboratories focusing on surface mount technology (SMT) and fine pitch electronic components.

Leaded solder paste with Sn62 Pb Ag2 alloy for high reliability. No-clean and chlorine-free composition minimizing residues and corrosion. Fine pitch print capability down to 400 μm for advanced PCB assemblies. High activity ensuring excellent wetting and solder flow during reflow.

Manual 30g syringe packaging for precise dispensing and control. Complies with NFC90550, J-STD-006, and EN 29453 standards. Manufactured in France to stringent quality standards. Explore more Solder Pastes and related power tools at EnvMart for high-quality professional soldering solutions.