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CHIPQUIK Lead Free Solder Paste 250 g Jar RoHS Compliant SMD291SNL250T3
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMD291SNL250T3 |
| Package Type | Jar |
| Package Size | 250 g |
| Standards/Approvals | RoHS, J-STD-006C, J-STD-004B, J-STD-005A |
| CHIPQUIK Lead Free Solder Paste, 50 g JarBrand | CHIPQUIK |
Key Features
- This paste contains 88.5% metal with SAC305 formulation for excellent solder performance.
- Compatible with fast printing speeds up to 100 mm/sec for efficient production.
- Wide process window and long stencil life improve manufacturing consistency.
- Leaves clear residue with low voiding for superior finished board quality.
- Provides excellent wetting on most board finishes for strong solder joints.
- Print grade suitable for enclosed print heads used in SMT assembly lines.
- Passes BONO test at 1.56%, ensuring quality and reliability.
- Complies with RoHS II and REACH standards for environmental safety.
Product Description
CHIPQUIK SMD291SNL250T3 Lead Free Solder Paste 250 g Jar is a premium solder paste formulated with SAC305, containing 88.5% metal content, optimized for surface-mount technology applications. It is RoHS and REACH compliant and meets industry standards including J-STD-006C, J-STD-004B, and J-STD-005A.
This Solder Paste supports printing speeds up to 100 mm/sec, maximizing throughput without compromising quality. Its long stencil life and wide process window help maintain stable printing results over extended production runs.
The paste leaves a clear and residue with low voiding, contributing to the reliability of electrical connections and the overall integrity of assembled printed circuit boards. It exhibits excellent wetting compatibility across a broad range of board finishes, ensuring strong solder joints.
The product is designed to work well with enclosed print heads, making it suitable for automated SMT manufacturing lines. It passes strict quality tests such as the BONO test at 1.56%, confirming its consistent quality and performance.
Common industrial use cases include electronics manufacturing, assembly lines in industrial automation, aerospace components production, telecommunications equipment, and precision instrumentation.
This paste contains 88.5% metal with SAC305 formulation for excellent solder performance. Compatible with fast printing speeds up to 100 mm/sec for efficient production. Wide process window and long stencil life improve manufacturing consistency.
Leaves clear residue with low voiding for superior finished board quality. Provides excellent wetting on most board finishes for strong solder joints. Print grade suitable for enclosed print heads used in SMT assembly lines.
Passes BONO test at 1.56%, ensuring quality and reliability. Complies with RoHS II and REACH standards for environmental safety. Explore more high-quality soldering consumables and equipment at EnvMart to enhance your electronics production process.
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Frequently Asked Questions
This solder paste contains 88.5% metal content, formulated with SAC305 for excellent solder performance.
It complies with RoHS II and REACH standards, as well as industry standards including J-STD-006C, J-STD-004B, and J-STD-005A.
It supports printing speeds up to 100 mm/sec, allowing for efficient production in manufacturing processes.
The paste leaves a clear residue with low voiding, contributing to superior finished board quality.
Yes, it is designed to work well with enclosed print heads, making it suitable for automated surface-mount technology (SMT) assembly lines.
Common applications include electronics manufacturing, industrial automation assembly lines, aerospace components production, telecommunications equipment, and precision instrumentation.
This solder paste is available in a 250 g jar, providing a convenient amount for various manufacturing needs.
The solder paste is manufactured in Canada, ensuring quality and compliance with international standards.
It passes the BONO test at 1.56%, confirming its consistent quality and reliability in performance.
The solder paste is formulated with SAC305, which is known for its excellent soldering properties.
The wide process window and long stencil life help maintain stable printing results over extended production runs, improving manufacturing consistency.
The brand of this solder paste is CHIPQUIK, known for its quality soldering materials.
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