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CHIPQUIK Lead Free Solder Paste 50 g Jar J-STD-006C, J-STD-004B, RoHS SMD291SNL50T3
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMD291SNL50T3 |
| Package Type | Jar |
| Package Size | 50 g |
| Standards/Approvals | J-STD-006C, J-STD-004B, RoHS, J-STD-005A |
| CHIPQUIK Lead Free Solder Paste, 250 g JarBrand | CHIPQUIK |
Key Features
- Lead free solder paste compliant with RoHS and industry standards.
- Package contains 50 g jar suitable for precise soldering applications.
- Supports printing speeds up to 100 mm/sec ensuring high productivity.
- Wide process window and clear residue improve manufacturing quality.
- Excellent wetting compatibility on various board finishes reduces defects.
- Passes BONO test at 1.56% for reliable quality assurance.
- Compatible with enclosed print heads for versatile printing solutions.
- Manufactured in Canada with certifications J-STD-006C, J-STD-004B, and J-STD-005A.
Product Description
CHIPQUIK SMD291SNL50T3 lead free solder paste is a high-quality SAC305 no clean solder paste packed in a 50 g jar. This solder paste features 88.5% metal content and supports printing speeds of up to 100 mm/sec, allowing efficient and fast circuit board assembly. It delivers a wide process window which facilitates ease of use across diverse soldering processes.
It leaves a clear residue and exhibits excellent wetting compatibility on most board finishes, reducing the likelihood of solder joint failures and improving the overall reliability of the electronic assemblies. The solder paste passes the BONO test at 1.56%, further assuring its quality and performance in critical manufacturing environments.
This product is compatible with enclosed print heads and offers a long stencil life to minimize downtime in production. It meets strict industry standards including J-STD-006C, J-STD-004B, RoHS, and J-STD-005A, making it suitable for electronics manufacturing within hazardous material regulations. The solder paste is RoHS II and REACH compliant, aligning with environmental and safety requirements.
Ideal for industrial and laboratory use, this solder paste is suitable for electronic assembly in manufacturing, repair, and prototyping applications. Its low voiding properties ensure high integrity solder joints, enhancing the performance and durability of the electronic devices.
Lead free Solder Paste compliant with RoHS and industry standards. Package contains 50 g jar suitable for precise soldering applications. Supports printing speeds up to 100 mm/sec ensuring high productivity. Wide process window and clear residue improve manufacturing quality.
Excellent wetting compatibility on various board finishes reduces defects. Passes BONO test at 1.56% for reliable quality assurance. Compatible with enclosed print heads for versatile printing solutions. Manufactured in Canada with certifications J-STD-006C, J-STD-004B, and J-STD-005A.
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Frequently Asked Questions
This solder paste complies with several industry standards including J-STD-006C, J-STD-004B, RoHS, and J-STD-005A, ensuring it meets rigorous quality and safety requirements for electronics manufacturing.
The solder paste contains 88.5% metal content, which contributes to its performance in soldering applications.
It is packaged in a 50 g jar, making it suitable for precise soldering applications.
This model supports printing speeds of up to 100 mm/sec, which enhances productivity during circuit board assembly.
It exhibits excellent wetting compatibility on various board finishes, which helps reduce defects in solder joints.
It passes the BONO test at 1.56%, indicating reliable quality assurance for critical manufacturing environments.
Yes, it is RoHS II and REACH compliant, aligning with environmental and safety requirements for hazardous materials.
This product is suitable for electronic assembly in manufacturing, repair, and prototyping applications.
It is compatible with enclosed print heads, providing versatility in printing solutions.
It is manufactured in Canada, ensuring adherence to quality standards during production.
The clear residue improves manufacturing quality by reducing the likelihood of solder joint failures, enhancing the reliability of electronic assemblies.
It offers a wide process window and a long stencil life, facilitating ease of use and minimizing downtime in production.
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