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MBO Lead Free Solder Wire 0.35 mm Diameter, 217 °C Melting Point SN96.5 AG3 CU0.5 3,5/10 RT15 - 100G

Category Solder Wire Brand MBO Condition New

Specifications

Country of Origin France
Brand MBO
Model SN96.5 AG3 CU0.5 3,5/10 RT15 - 100G
Melting Point 217°C
Product Weight 100g
Wire Diameter 0.35mm
Product Form Wire
Percent Lead 0%
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin
Percent Copper 0.5%
Multicore Wire, 0.25 mm Lead Free Solder, 217 °C Melting PointBrand Multicore

Key Features

  • The wire has a uniform diameter of 0.35 mm for consistent soldering performance.
  • Contains 0% lead, making it environmentally friendly and RoHS compliant.
  • Melting point is 217 °C, optimal for electronic and electrical soldering.
  • Flux type is rosin, ensuring reliable solder joints without contamination.
  • The product weight is 100 grams, ideal for small-scale soldering tasks.
  • Composed mainly of 96.5% tin with alloying silver and copper to enhance solder strength.
  • The solder wire is designed for both standard and no-clean soldering processes (RT15).
  • Manufactured in France, ensuring high quality and consistency.

Product Description

MBO SN96.5 AG3 CU0.5 3,5/10 RT15 - 100G lead free solder wire is engineered for precise electronic and electrical soldering applications. It has a wire diameter of 0.35 mm and a melting point of 217 °C, providing excellent flow and wetting properties.

This solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, ensuring strong mechanical and electrical joints. The rosin flux type promotes clean and reliable soldering by reducing oxidation and improving flow characteristics.

Suitable for use in manufacturing, repair, and rework of electronic components and circuits, this solder wire adheres to stringent manufacturing standards. It is lead-free, aligning with environmental and safety regulations.

The 100 gram spool size is convenient for a wide range of soldering tasks, from delicate SMD repairs to general electronics assembly. The RT15 designation indicates it is no-clean solder wire, designed to leave minimal residue, reducing the need for post-solder cleaning.

The wire diameter of 0.35 mm provides precision and control during soldering. Lead-free composition enhances safety and compliance with regulations. 217 °C melting point offers efficient solder flow. Rosin flux ensures superior solder joint quality.

Contains silver and copper for enhanced joint strength and conductivity. No-clean solder wire reduces maintenance and post-processing.

Manufactured in France, this product is suitable for industrial, laboratory, and manufacturing environments requiring reliable solder wire with consistent properties. Ideal for electronics assembly, repair, and prototyping applications.

Discover more Solder Wire products and related soldering tools in the Electronics & Electricals category at EnvMart to meet your specialized requirements.

MBO Lead Free Solder Wire 0.35 mm Diameter, 217 °C Melting Point SN96.5 AG3 CU0.5 3,5/10 RT15 - 100G
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