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MBO Lead Free Solder Wire, 0.7 mm Diameter, Rosin Flux, 217 °C Melting Point, 100g SN96.5 AG3 CU0.5 7/10 RT15 - 100G

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MBO Lead Free Solder Wire, 0.7 mm Diameter, Rosin Flux, 217 °C Melting Point, 100g SN96.5 AG3 CU0.5 7/10 RT15 - 100G

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Category Solder Wire Brand MBO Condition New

Specifications

Country of Origin	France
Brand	MBO
Model	SN96.5 AG3 CU0.5 7/10 RT15 - 100G
Melting Point	217°C
Product Weight	100g
Wire Diameter	0.7mm
Product Form	Wire
Percent Lead	0%
Percent Silver	3%
Percent Tin	96.5%
Flux Type	Rosin
Percent Copper	0.5%

Key Features

The wire diameter is 0.7 mm providing fine soldering control.
Composed of 96.5% Tin, 3% Silver, and 0.5% Copper alloy.
Flux type used is rosin ensuring effective flux activity.
Product form is wire ideal for electronics and electrical soldering.
Suitable for no-clean applications with fast wetting properties.
Produced in France maintaining high manufacturing standards.
Perfect for SMD repairs and soldering connectors on various substrates.
Comes in a 100g spool for convenient usage and storage.

Product Description

MBO SN96.5 AG3 CU0.5 7/10 RT15 - 100G is a high-quality lead free solder wire specifically engineered for electronics soldering applications requiring reliability and precision. It features a 0.7 mm diameter wire composed primarily of Tin (96.5%), Silver (3%), and Copper (0.5%). The rosin flux embedded in the wire provides excellent oxidation prevention and solder joint quality.

With a melting point of 217 °C, this solder wire suits a wide range of soldering tasks including Surface Mount Device (SMD) repairs and fastening connectors to diverse substrates. The no-clean solder formulation reduces residues and cleaning requirements, making it practical for industrial and laboratory use.

Manufactured in France, this product complies with industry standards to deliver consistent performance and durability. The 100 g spool size balances usability and portability, ideal for professional electronics assembly, repair, and manufacturing.

The solder wire's fast wetting characteristics enhance solder joint integrity and facilitate faster, more efficient soldering workflows. Industrial use cases include electronics manufacturing, laboratory instrument assembly, telecommunications equipment repair, and HVAC control system installations.

The wire diameter is 0.7 mm providing precise soldering application. Consists of a solder alloy with 96.5% Tin, 3% Silver and 0.5% Copper. Employs rosin flux for effective soldering and oxidation control. Lead free composition supports environmental compliance.

Melting point at 217 °C enables energy-efficient processing. No-clean solder wire simplifies post-solder cleaning tasks. Supplied as 100 g spool suitable for industrial and laboratory usage. Designed for soldering connectors and SMD repair across all substrates.

Explore more products in the Solder Wire category at EnvMart for a comprehensive selection of soldering materials and accessories tailored for professional and industrial applications.