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Multicore Lead Solder Wire 1.2 mm Diameter, 179 °C Melting Point, 36% Lead, 2% Silver, 62% Tin, Activated Rosin Flux 291749

Category Solder Wire Brand Multicore Condition New

Specifications

Country of Origin Malaysia
Brand Multicore
Model 291749
Melting Point 179°C
Product Weight 500g
Wire Diameter 1.2mm
Product Form Wire
Percent Lead 36%
Percent Silver 2%
Percent Tin 62%
Flux Type Activated Rosin
Multicore Wire, 0.7mm Lead solder, 179°C Melting PointBrand Multicore

Key Features

  • This solder wire contains 36% lead to provide a dependable eutectic melting transition.
  • The composition includes 2% silver and 62% tin for optimal bonding quality.
  • It features activated rosin flux built into the wire for improved soldering cleanliness and flow.
  • The wire weight is 500 grams, suitable for consistent use in manufacturing or repair.
  • It conforms to BS219 Grade 62S and DIN 1707 standards for quality assurance.
  • The product originates from Malaysia, ensuring compliance with manufacturing excellence.
  • The melting point of 179 °C helps minimize thermal damage to sensitive components.
  • The low melting point solder is ideal for repairs on fabricated circuit boards.

Product Description

Multicore 291749 Lead Solder Wire offers a precision soldering solution with a 1.2 mm diameter wire and a clean melting point of 179 °C. This alloy contains 36% lead, 62% tin, and 2% silver, combined with activated rosin flux cores for enhanced flow and solder joint quality. The 500 gram wire spool supports various soldering tasks in electronics manufacturing, assembly, and repair.

The solder complies with BS219 Grade 62S and DIN 1707 standards, ensuring reliable performance across industrial and laboratory environments. Its eutectic melting characteristic enables a sharp melting transition, significantly reducing thermal stress and preventing component damage during board repairs.

This solder wire is particularly suitable for use in electrical and electronic applications requiring precise solder deposits and consistent bonding strength. The integrated activated rosin flux cores assist in cleaning and fluxing the metal surfaces during soldering, resulting in improved joint reliability.

Originating from Malaysia, this product is made to strict manufacturing protocols to meet demanding industrial criteria. The moderate wire diameter supports accurate placement and smooth solder flow in both commercial and laboratory settings.

This solder wire contains 36% lead to provide a dependable eutectic melting transition. The composition includes 2% silver and 62% tin for optimal bonding quality. It features activated rosin flux built into the wire for improved soldering cleanliness and flow.

The wire weight is 500 grams, suitable for consistent use in manufacturing or repair. It conforms to BS219 Grade 62S and DIN 1707 standards for quality assurance. The product originates from Malaysia, ensuring compliance with manufacturing excellence.

The melting point of 179 °C helps minimize thermal damage to sensitive components. The low melting point solder is ideal for repairs on fabricated circuit boards.

Choose the Multicore 291749 Solder Wire for dependable performance in electronics assembly, repair, and industrial soldering environments. Explore more in the soldering tools and supplies category on EnvMart.

Multicore Lead Solder Wire 1.2 mm Diameter, 179 °C Melting Point, 36% Lead, 2% Silver, 62% Tin, Activated Rosin Flux 291749
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