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MBO Lead Free Solder Wire 1 mm Diameter 100 g Weight 217 °C Melting Point SN96.5 AG3 CU0.5 10/10 RT15 - 100G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN96.5 AG3 CU0.5 10/10 RT15 - 100G |
| Melting Point | 217°C |
| Product Weight | 100g |
| Wire Diameter | 1mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin |
| Percent Copper | 0.5% |
Key Features
- This solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, ensuring excellent conductivity.
- The wire is lead free, compliant with modern environmental standards and safe for use in electronics.
- It is suitable for SMT repairs and connector soldering on various substrates.
- The rosin flux type improves solderability and wetting characteristics, facilitating effective bonding.
- The product has a weight of 100 grams, ideal for controlled usage in industrial and laboratory settings.
- Manufactured in France, it meets quality standards specific to solder wire applications.
Product Description
MBO SN96.5 AG3 CU0.5 10/10 RT15 - 100G lead free solder wire features a 1 mm diameter wire with a melting point of 217 °C suitable for precision soldering tasks across industrial, laboratory, and manufacturing sectors.
This solder wire consists of 96.5% tin, 3% silver, and 0.5% copper content, providing reliable electrical conductivity and mechanical strength. The rosin flux type enhances solder joint quality by promoting fast wetting and adhesion.
The wire is free from lead, making it compliant with RoHS directives and environmentally responsible for electronics production and repairs. It is particularly effective for use in surface mount device (SMD) repairs and connector soldering on diverse substrates.
Manufactured in France, the product ensures consistent quality and durability required for professional soldering applications in electronics manufacturing, repair workshops, and research facilities.
This solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, ensuring excellent conductivity. The wire is lead free, compliant with modern environmental standards and safe for use in electronics. It is suitable for SMT repairs and connector soldering on various substrates.
The rosin flux type improves solderability and wetting characteristics, facilitating effective bonding. The product has a weight of 100 grams, ideal for controlled usage in industrial and laboratory settings. Manufactured in France, it meets quality standards specific to solder wire applications.
Explore a wide range of Solder Wire products and related soldering tools available at EnvMart for all industrial and laboratory soldering needs.
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Frequently Asked Questions
The melting point of this solder wire is 217 °C.
This solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper.
The wire has a diameter of 1 mm.
The weight of this solder wire is 100 grams.
It uses rosin flux, which enhances solderability and wetting characteristics.
Yes, this solder wire is lead-free, making it compliant with modern environmental standards.
This solder wire is manufactured in France.
The 96.5% tin content ensures excellent electrical conductivity and mechanical strength in solder joints.
The composition includes 96.5% tin, 3% silver, and 0.5% copper, providing reliable performance.
The product form is wire, specifically designed for soldering applications.
It meets quality standards specific to solder wire applications, ensuring consistent quality for professional use.
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