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MBO Lead Free Solder Wire 1 mm Diameter 217 °C Melting Point 500g SN96.5 AG3 CU0.5 10/10 A11 - 500G

Category Solder Wire Brand MBO Condition New

Specifications

Country of Origin France
Brand MBO
Model SN96.5 AG3 CU0.5 10/10 A11 - 500G
Melting Point 217°C
Product Weight 500g
Wire Diameter 1mm
Product Form Wire
Percent Lead 0%
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin
Percent Copper 0.5%
RS PRO Wire, 1.01 mm Lead Free Solder, 217 °C Melting PointBrand RS PRO
Multicore Wire, 1 mm Lead Free Solder, 217 °C Melting PointBrand Multicore
MBO Wire, 1.5 mm Lead Free Solder, 217 °C Melting PointBrand MBO

Key Features

  • The solder wire is lead free, containing 0% lead and composed of 96.5% tin, 3% silver, and 0.5% copper.
  • It features a rosin flux type suitable for no-clean soldering processes.
  • The wire is provided in a 500 gram spool, ideal for precise and consistent soldering.
  • Designed for soldering connectors on various substrates, supporting both activated no-clean (A11) and no-clean (RT15) soldering workflows.
  • The product is manufactured in France ensuring high quality and compliance with industrial standards.
  • Applicable for both manual and automated soldering in industrial, electronics manufacturing, and repair scenarios.

Product Description

MBO SN96.5 AG3 CU0.5 10/10 A11 - 500G lead free solder wire offers premium soldering performance with its precise 1 mm diameter wire and low melting point of 217 °C. This solder wire is formulated with 96.5% tin, 3% silver, and 0.5% copper, and completely free of lead, making it environmentally safe and compliant with modern regulations.

The rosin flux embedded in the wire ensures effective wetting and excellent joint reliability, especially suitable for no-clean soldering applications in electronics assembly and repair. Both standard no-clean (RT15) and activated no-clean (A11) versions are available, with A11 spools often used for soldering connectors on diverse substrates and RT15 spools suitable for fast wetting required during Surface Mount Device (SMD) repair.

This spool contains 500 grams of solder wire, appropriate for industrial and laboratory use including manufacturing, electronics maintenance, and custom prototyping. The product originates from France, ensuring adherence to stringent quality controls and consistent output performance.

Key applications include soldering of electrical components, connectors, circuit boards, and smaller electronic devices where precision and reliability are paramount. Its composition enhances joint strength and corrosion resistance, vital for durable electronic assemblies.

Lead free and RoHS compliant solder wire with 0% lead content. Melting point of 217 °C enables controlled soldering temperatures. Contains silver and copper for enhanced mechanical strength and electrical conductivity. Rosin flux core supports no-clean, activated no-clean soldering methods.

Manufactured in France, quality assured for professional usage. Explore EnvMart for more Solder Wire options, soldering accessories, and other electronic assembly tools to support your industrial and laboratory requirements.

MBO Lead Free Solder Wire 1 mm Diameter 217 °C Melting Point 500g SN96.5 AG3 CU0.5 10/10 A11 - 500G
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